Separated Heat Sink and Lead Frame in Semiconductor Packages
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Solution Overview
Problem
Semiconductor device packages face challenges in reliability due to issues such as resin burr formation and cracking in the sealing body, which affect electrical coupling and heat dissipation, and existing solutions either increase costs or degrade reliability.
Innovation Solution
The semiconductor device package is designed with a heat sink unit and outer lead unit separated from each other, incorporating chip placement portions that are electrically coupled with outer leads, and using a resin stopper to prevent resin leakage, allowing for independent positioning of heat sinks and leads without pressing, thus preventing resin burr and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat sink and lead portion are integrated in existing structures, then manufacturing is simpler, but resin burr formation and cracking occur in the sealing body
Solution Approach 1:
The patent divides the traditionally integrated lead frame into separate functional units: the heat sink unit and the lead portion unit. This segmentation allows independent optimization of each unit's structure and positioning, preventing resin burr formation and cracking by eliminating stress concentration points at integration interfaces, thereby improving package reliability without significantly complicating the overall manufacturing process
2Manufacturing precision
If pressing is used to position heat sinks and leads, then positioning precision is improved, but resin leakage and burr formation occur
Solution Approach 1:
The patent incorporates positioning protrusions and positioning grooves directly into the mold structure. This preliminary action ensures that heat sinks and leads are automatically positioned with high precision during the molding process itself, eliminating the need for subsequent pressing operations that would cause resin leakage and burr formation
3Reliability
If the chip placement portion and heat sink are closely integrated, then electrical coupling is improved, but heat dissipation is degraded
Solution Approach 1:
By separating the heat sink unit from the lead portion unit with independent positioning, the patent creates optimal thermal pathways for heat dissipation while maintaining effective electrical coupling through the semiconductor chip. The segmented structure allows the heat sink to be positioned for maximum thermal efficiency without being constrained by integration requirements, resolving the contradiction between electrical coupling and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the semiconductor device package by preventing resin burr and cracking, ensuring effective electrical coupling and heat dissipation without increasing costs or degrading reliability.
Implementation Method 1
dissipating heat produced when the semiconductor chip is in operation
Data Source
AI summary
A technology with which the reliability of a package making up a semiconductor device can be enhanced is provided. A feature of the technical idea of the invention is that: a heat sink unit and an outer lead unit are separated from each other: and the outer lead unit is provided with chip placement portions and each of the chip placement portions and each heat sink are joined together. As a result, when a sealing body is formed at a resin sealing step, tying portions function as a stopper for preventing resin leakage and the formation of resin burr in a package product can be thereby prevented. In addition, camber does not occur in the heat sink unit and cracking in a sealing body caused by winding (camber) can be suppressed.