Separation Film Removal Yield via Adhesion-Based Laser Control
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Solution Overview
Problem
The existing method for transferring thin film components onto a substrate faces yield reduction due to variations in laser oscillator output and optical system performance, leading to inconsistent irradiation energy and thermal conditions, which can cause defects in the separation film removal process.
Innovation Solution
A method involving the formation of a separation film on a supporting substrate, followed by the application of light to accelerate the removal of a component support, with image data analysis to determine the degree of adhesion and adjust the light application process to ensure proper removal, thereby improving yield by reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser light is applied to the separation film using a galvano scanner method with a spot beam of 1 mm or smaller, then the separation film can be removed, but variations in energy, irradiation diameter, and target position occur among shots, reducing yield
Solution Approach 1:
The patent applies different beam diameters to different regions of the separation film based on local adhesion characteristics. The determining process identifies highly attached portions through image analysis, and the light applying process uses a larger beam diameter for these portions while using a smaller beam diameter for normally attached portions. This local differentiation resolves the contradiction by ensuring reliable removal of strongly adhered areas without causing damage to normally attached areas, thereby maintaining both manufacturing precision and yield.
2Productivity
If the output level of laser light is increased to ensure separation film removal, then removal efficiency improves, but variations in laser oscillator or optical system cause inconsistent irradiation energy, leading to forced removal and reduced yield
Solution Approach 1:
The patent dynamically adjusts the beam diameter of the laser light based on the adhesion state of the separation film. Rather than using a fixed output level that may cause forced removal, the system determines the adhesion state through image analysis and adapts the light applying parameters accordingly. This dynamic adjustment ensures efficient removal when needed while preventing damage when adhesion is normal, resolving the contradiction between removal efficiency and yield.
3Measurement precision
If the spot beam diameter is reduced to 1 mm or smaller for precise laser application, then target positioning accuracy improves, but variations in target position and energy distribution increase, making separation less reliable
Solution Approach 1:
The patent uses different beam diameters for different local regions of the separation film based on adhesion characteristics identified through image analysis. For highly attached portions, a larger beam diameter is used to ensure complete coverage and removal. For normally attached portions, a smaller beam diameter maintains positioning accuracy. This local differentiation resolves the contradiction by ensuring both precise targeting and consistent separation across the entire film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield by ensuring accurate determination of adhesion levels and optimizing light application, reducing the likelihood of defects and improving the reliability of the component transfer process.
Implementation Method 1
a separation film forming process for forming a separation film on a supporting substrate; a light applying process for applying light to the separation film for accelerating a removal of the component support
Data Source
AI summary
A method of producing a CF board and an array board includes: a separation film forming process for forming separation films on supporting substrates; a component support forming process for forming resin substrates on the separation films; a thin film component forming process for forming TFTs and color filters that are thin film components on the resin substrates; a light applying process for applying light to the separation films for accelerating removals of the resin substrates; a determining process for determining whether levels of adhesion between the separation films and the resin substrates are high or low based on image data obtained through capturing of images of the separation films, and a removing process for removing the resin substrates from the supporting substrates if the levels of adhesion are determined low in the determining process.