Separation Pattern Layout for Bridge-Free Semiconductor Interconnects
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Solution Overview
Problem
As design rules for semiconductor devices decrease, unwanted bridges can occur between conductive patterns due to the shrinking spaces, leading to manufacturing challenges in integrated circuit devices.
Innovation Solution
A method involving the formation of an intermediate structure layer with conductive pillars, a separation layer, and a separation pattern to create holes and trenches, followed by filling these patterns with conductive materials to prevent bridging between conductive pillars, using techniques like EUV lithography and chemical mechanical polishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If spaces between conductive patterns are decreased to meet smaller design rules, then integration density is improved, but unwanted bridges occur between conductive patterns
Solution Approach 1:
The patent introduces separation patterns that divide and isolate conductive patterns from each other. These separation patterns include holes exposing portions of first conductive pillars and trenches exposing portions of second conductive pillars, creating physical segmentation that prevents unwanted bridging while maintaining small design rules
Solution Approach 2:
The patent uses a separation layer as an intermediary material between conductive patterns. This separation layer, when selectively removed to form separation patterns, provides controlled isolation between conductive elements, preventing direct contact and potential bridging while allowing necessary electrical connections through the exposed portions
2Reliability
If separation patterns with holes and trenches are formed to prevent bridging, then reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The separation layer is formed in advance before the final conductive pattern formation. This preliminary action of creating the separation layer with predetermined hole and trench patterns allows for controlled isolation to be established before subsequent manufacturing steps, simplifying the overall process by pre-establishing the isolation structure
Solution Approach 2:
The patent combines multiple functions into the separation patterns: they provide bridging prevention, define exposure areas for conductive pillars, create trenches for isolation, and serve as a template for subsequent conductive material deposition. This merging of multiple functions into a single structure reduces the number of separate process steps needed
Data Source
AI summary
There is disclosed a method of manufacturing a semiconductor device including a separation pattern. An intermediate structure layer including first conductive pillars and second conductive pillars is formed over a semiconductor substrate. A separation layer is formed. Some portions of the separation layer is selectively removed to form a separation pattern, and third conductive patterns filling holes of the separation pattern and fourth conductive patterns filling trenches of the separation pattern are formed.