Electrochemical Device Separator Bonding for Thin IC Card Integration

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Solution Overview

Problem

Conventional electrochemical devices, such as EDLCs, are too thick for incorporation into thin electronic devices like IC cards due to the use of insulation tape for positioning internal electrodes and separators, which limits their thinness and functionality.

Innovation Solution

The electrochemical device employs a separator bonding part and an electrode bonding part on the inner surface of the exterior sheet to securely position the separator and internal electrodes without the need for insulation tape, allowing for a thinner design by eliminating the thickness contributed by the tape and preventing position shifting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If insulation tape is used to position internal electrodes and separator, then positioning accuracy is improved, but device thickness increases

Engineering Contradiction:
Improvepositioning accuracyVSAvoiddevice thickness
Core Design Contradiction:
Manufacturing precisionVSLength of stationary object

Solution Approach 1:

The patent removes the insulation tape component from the device structure entirely. Instead of using separate positioning tape, the separator itself is designed with adhesive properties to bond directly to the internal electrodes, eliminating the need for additional positioning materials and reducing overall device thickness.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the positioning function and the separator function into a single integrated component. The separator is designed with adhesive layers that simultaneously provide structural separation and precise positioning, merging multiple functions into one element to eliminate additional thickness from separate positioning components.

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If insulation tape is used for positioning, then positioning stability is improved, but device complexity increases

Engineering Contradiction:
Improvepositioning stabilityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts the positioning function from a separate component (insulation tape) and integrates it into the separator itself. This reduces device complexity by eliminating additional components while maintaining positioning stability through the adhesive properties of the separator.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The separator is designed to perform multiple functions simultaneously: electrical insulation, physical separation, and precise positioning. By making the separator multi-functional with adhesive properties, the patent reduces overall device complexity while maintaining positioning stability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Length of stationary object

If separator bonding part is formed on inner layer of exterior sheet, then device thickness is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedevice thicknessVSAvoidbonding precision
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The patent introduces an adhesive layer as an intermediary between the separator and the inner layer of the exterior sheet. This adhesive mediator enables precise bonding at the molecular level, allowing for thin device construction while maintaining the necessary bonding precision through chemical adhesion rather than mechanical fastening.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the electrochemical device to be thinned to 1 mm or less, making it suitable for incorporation into thin electronic devices like IC cards while maintaining effective sealing and preventing short circuits.

Implementation Method 1

a separator bonding part for fixing at least part of the separator sheet to an inner surface of the exterior sheet is formed on an inner layer made of a resin present on the inner surface of the exterior sheet

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

a sealing part to seal an outer edge of the exterior sheet for immersing the element main body in an electrolyte

Methodology Applied
Scientific EffectAbsorption/Immersion: Absorption (physical)

Data Source

PatentUS10879016B2Electrochemical device and method for manufacturing same
Publication Date: 2020.12.29 TDK CORP
  • US10879016B2 patent drawing
  • US10879016B2 patent drawing
  • US10879016B2 patent drawing

AI summary

An electrochemical device which includes: an element main body wherein a pair of internal electrodes are laminated so as to sandwich a separator sheet there between; an outer casing sheet that covers the element main body; sealing parts that hermetically seal the peripheral part of the outer casing sheet so that the element main body is immersed in an electrolyte solution; and lead terminals that are electrically connected to the internal electrodes respectively and are led out from the sealing parts of the outer casing sheet to the outside. A resin inner layer that is present in the inner surface of the outer casing sheet is provided with a fusion bonding part for separators, which partially bonds a part of the separator sheet to the inner surface of the outer casing sheet.