Separator Laminate Release Surface for Uniform Protective Layer Peeling

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Solution Overview

Problem

Existing methods face issues with non-uniform deposition of protective layers on separators due to resin repulsion and excessively high peel strength during peeling, leading to partial adhesion or breakage of protective layers in printed wiring boards.

Innovation Solution

A laminate structure with a silicone resin film as a release surface having a water contact angle of 107.1° or greater, combined with a protective layer containing polyurethane resin, polyamide-imide resin, or polyamide resin, ensures uniform deposition and low peel strength, allowing easy peeling after thermocompression bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a silicone resin film is used as a release surface with high water contact angle to improve peelability, then the separator repels protective layer causing non-uniform deposition, but reducing water contact angle compromises peel strength control

Engineering Contradiction:
ImprovepeelabilityVSAvoidprotective layer uniformity
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by precisely controlling the water contact angle of the silicone resin film to be within 100° to 110°, and controlling the gel fraction of the silicone resin to be within 30% to 70%. This optimized parameter range balances the repulsion effect for easy peeling with the attraction effect needed for uniform protective layer deposition, resolving the contradiction between peelability and manufacturing precision

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining silicone resin with specific gel fraction (30-70%) and controlling the molecular weight distribution (PDI) to be within 1.05 to 1.30. This composite approach creates a release surface with balanced properties that simultaneously achieves easy peeling and uniform protective layer formation

Inventive Principle:
Principle #40Composite materials

2Strength

If the separator is designed with high peel strength to prevent adhesion, then the protective layer breaks during peeling, but reducing peel strength causes partial adhesion of protective layer to separator

Engineering Contradiction:
Improvepeel strengthVSAvoidprotective layer integrity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent resolves this contradiction by changing the parameters of the silicone resin film, specifically controlling the gel fraction (30-70%) and water contact angle (100°-110°). These parameter optimizations enable the separator to have moderate peel strength that prevents protective layer adhesion while avoiding excessive strength that would cause protective layer breakage during peeling

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies the copying principle by creating a release surface with controlled properties that replicates the desired balance between adhesion and non-adhesion. The silicone resin film with specific gel fraction and water contact angle acts as a copy of the base material interface, providing controlled interaction strength that protects the protective layer integrity while enabling clean separation

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laminate enables uniform formation of protective layers and controlled peel strength, facilitating the transfer of conductive material layers to base materials, resulting in improved printed wiring boards with enhanced precision and reliability.

Implementation Method 1

the release surface having a water contact angle of 107.1° or greater

Methodology Applied
Scientific EffectWater contact angle: Surface Tension

Implementation Method 2

Then, the transfer film is thermocompression-bonded to the base material. In this step, the conductive paste is hardened into an electric circuit.

Methodology Applied
Scientific EffectThermocompression bonding:

Data Source

PatentEP4703135A1Laminate, method for producing laminate, and method for producing printed wiring board
Publication Date: 2026.03.04 TATSUTA ELECTRICWIRE & CABLE
  • EP4703135A1 patent drawingFigure 1A~1B
  • EP4703135A1 patent drawingFigure 2A~4
  • EP4703135A1 patent drawingFigure 5A~5B

AI summary

Provided is a laminate in which a protective layer is uniformly deposited on a separator and the separator after thermocompression bonding has a peel strength that is not excessively high. The laminate of the present invention is a laminate that includes: a separator including a substrate and a disposed on a surface of the substrate, the silicone resin film serving as a release surface; and a protective layer deposited on the separator and in contact with the release surface. The release surface has a water contact angle of 107.1° or greater. The protective layer contains at least one resin selected from the group consisting of polyurethane resin, polyamide-imide resin, and polyamide resin.