Separator Surface Composition for Solvent-Free Adhesion and Heat Resistance
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Solution Overview
Problem
Existing separators for electrochemical devices require organic solvents in the coating process, leading to increased investment costs and environmental regulations, and there is a need for improved adhesive force during lamination and stacking processes without compromising heat resistance.
Innovation Solution
A separator comprising a porous polymer substrate with a coating layer containing specific ratios of halogen and metal atoms on its surface, along with polymer binder particles and inorganic particles, to enhance dry and wet adhesive forces without using organic solvents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If organic solvent is used in the coating process, then adhesive force is improved, but investment cost increases and environmental regulations are imposed
Solution Approach 1:
The patent changes the chemical composition parameters of the coating layer by controlling the content of halogen atoms (1-10 wt%) and metal atoms (1-20 wt%), which enables the coating layer to achieve adequate adhesive force without requiring organic solvents, thereby reducing investment costs while maintaining bonding performance
Solution Approach 2:
The patent uses a composite coating layer containing polymer binder particles, inorganic particles, and specific ratios of halogen and metal atoms. This composite structure provides both adhesive force and heat resistance without needing organic solvents, resolving the contradiction between strength and manufacturing ease
2Strength
If organic solvent is used in the coating process, then adhesive force is improved, but environmental regulations are imposed
Solution Approach 1:
The patent extracts and eliminates the organic solvent component from the coating process entirely, replacing it with a solvent-free coating layer composition containing polymer binder particles, inorganic particles, and controlled halogen and metal atom contents, thereby maintaining adhesive force while removing environmental harm
Solution Approach 2:
By changing the compositional parameters to include specific amounts of halogen atoms (1-10 wt%) and metal atoms (1-20 wt%), the patent achieves adequate adhesive force through chemical composition rather than organic solvents, eliminating environmental regulations while preserving bonding strength
3Strength
If coating layer composition is adjusted to improve adhesive force, then bonding performance is improved, but heat resistance may be compromised
Solution Approach 1:
The patent creates a composite coating layer combining polymer binder particles with inorganic particles and controlled halogen/metal atom contents. This composite structure provides both adhesive force for bonding and heat resistance for thermal stability, resolving the contradiction between strength and temperature resistance
Solution Approach 2:
The patent optimizes the compositional parameters by limiting halogen atoms to 1-10 wt% and metal atoms to 1-20 wt%, which provides sufficient adhesive force while preventing excessive halogen content from compromising heat resistance, achieving both bonding performance and thermal stability
Data Source
AI summary
Disclosed is a separator for an electrochemical device and an electrochemical device comprising the same. The separator adjusts the contents of halogen atoms and metal atoms exposed on the surface of a coating layer, thereby enabling a dry adhesive force and a wet adhesive force to be improved and the heat resistance of the separator to be improved.