Sequential Component Embedding in Carriers to Suppress Warpage
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Solution Overview
Problem
The challenge of embedding components in a component carrier without pronounced warpage, particularly in stacked layers, while maintaining mechanical robustness and electrical reliability, is unresolved in existing technologies.
Innovation Solution
A method involving sequential embedding of components in separate holes within a stack, where a first component is embedded before forming a second hole, with adhesive structures applied below each component to prevent mechanical instability and warpage, and conductive contacts formed after complete embedding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple components are embedded simultaneously in separate holes of the stack, then productivity is improved, but warpage occurs due to mechanical instability
Solution Approach 1:
The patent applies preliminary action by forming and filling the first hole with adhesive and component before forming the second hole. This sequential approach ensures that each component is securely embedded and the structure is stabilized before proceeding to the next embedding operation, thereby preventing warpage while maintaining productivity
Solution Approach 2:
The embedding process is segmented into sequential steps for each component rather than simultaneous embedding. The first component is embedded, cured, and stabilized before the second component is embedded. This segmentation of the process prevents mechanical instability and warpage that would result from simultaneous multi-hole drilling and filling
2Ease of manufacture
If components are embedded in a stack with multiple simultaneous holes, then manufacturing effort is reduced, but mechanical stability deteriorates
Solution Approach 1:
The patent performs preliminary embedding and curing of the first component before creating the second hole. This preliminary action ensures mechanical stability is maintained throughout the manufacturing process, while the standardized sequential procedure keeps manufacturing effort reasonable
3Stability of the object's composition
If sequential embedding is performed, then warpage is suppressed, but manufacturing time increases
Solution Approach 1:
The sequential embedding process with preliminary curing steps suppresses warpage by ensuring each component is securely fixed before the next operation. The manufacturing time is optimized by efficiently executing each sequential step without unnecessary delays
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a component carrier with suppressed warpage and enhanced mechanical stability, allowing for a high die-to-package ratio without material restrictions, while maintaining electrical connectivity.
Implementation Method 1
with adhesive structures applied below each component to prevent mechanical instability and warpage
Data Source
Figure 1~5
Figure 6~7
AI summary
A method of manufacturing component carriers (100), wherein the method comprises providing a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), forming a first hole (108) in a core (134) of the stack (102) and subsequently embedding a first component (110) in the first hole (108), thereafter forming a second hole (114) in the same core (134) of the stack (102) and subsequently embedding a second component (116) in the second hole (114). The invention further relates to a component carrier.