Sequential Clip Bonding for Lead Frame Pitch Misalignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In high-voltage and high-current semiconductor packages, the pitch difference between lead frames and clip arrays often leads to misalignment during clip bonding, reducing bonding accuracy and increasing defect rates, as existing methods do not effectively correct for these differences.
Innovation Solution
An apparatus and method for bonding clips to semiconductor chips, where clips are sequentially bonded using a punch member, die member, and clip picker member, allowing for separate correction of pitch differences between lead frame and clip arrays, with the punch and die members made of Tungsten Carbide or SKD 11 for enhanced cutting and guiding, and the clip picker member using a multi-picker head for precise vacuum bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If clips are simultaneously bonded to multiple semiconductor chips, then bonding productivity is improved, but pitch difference between lead frame and clip arrays cannot be corrected causing misalignment
Solution Approach 1:
The invention segments the clip bonding process into individual sequential operations rather than simultaneous bonding. The clip array is divided into multiple clips that are bonded one by one to semiconductor chips, allowing independent pitch correction for each clip while maintaining overall productivity through automated sequential processing
Solution Approach 2:
The invention introduces dynamic pitch correction capability where the bonding position can be adjusted for each individual clip based on the actual pitch difference between the lead frame array and clip array. This dynamic adjustment allows the system to adapt to pitch variations while maintaining alignment accuracy
2Manufacturing precision
If clips are sequentially bonded 1 unit at a time, then pitch difference can be corrected to improve alignment accuracy, but bonding productivity decreases
Solution Approach 1:
The invention replaces traditional mechanical positioning systems with a vision-guided system that uses imaging to detect the actual positions of lead frames and clips. This allows for precise pitch measurement and correction without complex mechanical adjustments, maintaining high productivity while achieving accurate alignment
Solution Approach 2:
The invention changes the bonding parameters dynamically based on detected pitch differences. By adjusting bonding position coordinates according to measured pitch variations, the system maintains high alignment accuracy while processing clips sequentially at high speed through automated parameter adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes misalignment and increases bonding accuracy by allowing sequential bonding of clips according to the lead frame pitch intervals, achieving a high unit per hour production rate of over 20,000 with improved durability and electrical conductivity, while maintaining high bonding efficiency.
Implementation Method 1
the multi-picker head includes a plurality of picker heads which respectively vacuum adsorbs individual clip separated by being entered to the die holes
Data Source
AI summary
The present invention relates to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, and more particularly, to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, wherein the clips are sequentially bonded to the semiconductor chips by 1 unit so that a pitch difference between a lead frame array and a clip array is separately corrected to be the same and thereby, misalignment may be minimized so as to increase bonding accuracy of the clips to the semiconductor chips.