Sequential Coating Chambers With Buffering for Faster Workpiece Flow

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Solution Overview

Problem

Existing vapor deposition systems face inefficiencies in processing time and resource utilization due to varying requirements for preheating and cooling times of workpieces, leading to suboptimal processing times and potential degradation of workpieces.

Innovation Solution

A deposition apparatus with a sequential workflow including an infeed chamber, preheat chamber, deposition chamber, and cooldown chamber, utilizing a buffer system with conveyor receptacles and transfer mechanisms to optimize workpiece flow and minimize processing time while maintaining workpiece integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If workpieces are sequentially processed through preheat and cooldown chambers, then workpiece integrity is maintained, but processing time increases

Engineering Contradiction:
Improveworkpiece integrityVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The preheat chamber preheats workpieces before they enter the deposition chamber, preparing them in advance to prevent thermal shock and ensure proper coating adhesion. This preliminary action maintains workpiece integrity while optimizing the overall processing time by performing necessary heating before the critical deposition step.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The cooldown chamber acts as an intermediary between the deposition chamber and the output, gradually cooling workpieces after coating to prevent thermal stress and maintain integrity. This intermediate cooling step protects the freshly coated workpieces while enabling continuous processing flow.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If buffer systems with multiple receptacles are used, then workpiece flow is optimized, but device complexity increases

Engineering Contradiction:
Improveworkpiece flow optimizationVSAvoidbuffer system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The buffer system is segmented into multiple receptacles arranged in a sequential flow path, with each receptacle serving a specific function in the workpiece processing sequence. This segmentation allows independent optimization of each station while maintaining overall system productivity and enabling continuous operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The buffer chambers serve multiple functions: they act as temporary storage, provide thermal conditioning (preheating and cooling), and enable continuous operation by decoupling the deposition chamber from loading and unloading operations. This multi-functionality reduces the need for separate dedicated systems for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus enables high-speed coating with reduced processing times, minimizing unnecessary exposure to heating and cooling, and optimizing resource utilization, thereby enhancing the efficiency and longevity of workpieces.

Implementation Method 1

preheating and cooling times of workpieces

Methodology Applied
Scientific EffectThermal heating: Heating

Implementation Method 2

preheating and cooling times of workpieces

Methodology Applied
Scientific EffectThermal cooling: Cooling

Implementation Method 3

vapor deposition systems

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Data Source

PatentUS12529142B2Deposition apparatus and methods for sequential coating
Publication Date: 2026.01.20 RTX CORP
  • US12529142B2 patent drawing
  • US12529142B2 patent drawing
  • US12529142B2 patent drawing

AI summary

A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.