Sequential Plasma Unit Ignition for Substrate Treatment
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Solution Overview
Problem
High-energy plasma ignition during substrate treatment can cause damage and result in non-optimal layer composition and structure due to excessive power requirements for plasma ignition and maintenance.
Innovation Solution
A method involving multiple plasma units where the first unit is used for initial ignition at a lower power, and subsequent units are ignited with significantly lower power, utilizing the existing plasma to maintain and expand coverage across the substrate, minimizing high-energy plasma exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high ignition power is applied to plasma units, then plasma can be successfully ignited, but substrate damage occurs due to high-energy plasma particles and pressure waves
Solution Approach 1:
The plasma generation system is divided into multiple plasma units that are ignited sequentially rather than simultaneously. The first plasma unit is ignited with high power to establish a stable plasma, then subsequent plasma units are ignited with progressively lower power by utilizing the electromagnetic radiation from previously ignited units, thereby avoiding substrate damage from repeated high-power ignition events.
Solution Approach 2:
The first plasma unit is ignited in advance with high ignition power to create a stable plasma source. This pre-established plasma then serves as the ignition source for subsequent plasma units, which require significantly less power to ignite. This preliminary action eliminates the need for repeated high-power ignition attempts that would damage the substrate.
2Area of stationary object
If multiple plasma units are ignited with high ignition power, then complete substrate coverage is achieved, but layer composition and structure become non-optimal due to excessive growth rate
Solution Approach 1:
The substrate surface is divided into multiple regions, each treated by a separate plasma unit. The plasma units are ignited sequentially from the first to the last, with each subsequent unit utilizing the radiation from previous units for ignition. This segmented approach ensures that the entire substrate receives plasma treatment while maintaining optimal layer composition and structure, as each plasma unit operates at appropriate power levels without the excessive growth rates that would result from simultaneous high-power ignition of all units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate damage and achieves gentle plasma ignition, allowing for uniform plasma coverage and improved layer quality by controlling plasma power and positioning.
Implementation Method 1
a first plasma area is generated via a first plasma unit... a plasma is ignited in a plasma area of the second plasma unit by means of the plasma that has already been ignited in the first plasma area and the power fed into the second plasma unit
Data Source
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AI summary
The invention relates to a method and device for treating a substrate by means of a plasma. In the method, a plasma is produced by means of a plurality of plasma units, wherein first an ignition power is fed into at least one first plasma unit in order to produce a plasma adjacently thereto in a first plasma region. Subsequently or simultaneously thereto, a power is fed into at least one second plasma unit, said power being significantly less than the ignition power of the second plasma unit but being sufficient to maintain an already ignited plasma adjacently to the second plasma unit, wherein the second plasma unit lies adjacent to the first plasma unit in such a way that the first plasma region overlaps an emission region of the second plasma unit. By means of the already ignited plasma in the first plasma region and the power fed into the second plasma unit, a plasma is then ignited in the plasma region of the second plasma unit. The device comprises a plurality of adjacent plasma units for producing a plasma in a plasma region of the plasma units, wherein the plasma units are arranged in such a way that the plasma region of at least one first plasma unit overlaps an emission range of at least one adjacent second plasma unit. A control arrangement is provided, which is suitable for controlling at least the first and second plasma units independently of each other.