Sequestered Peroxide Hydrocolloid Adhesive for Wound Care
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Solution Overview
Problem
Current antimicrobial adhesives for wound care, ostomy, and incontinence devices face challenges such as adverse effects from high antimicrobial concentrations, emergence of antibiotic-resistant pathogens, and instability of hydrogen peroxide, leading to ineffective infection control and potential harm to the wound bed.
Innovation Solution
Development of a hydrocolloid adhesive with sequestered peroxide, chemically bonded to superabsorbent materials, which maintains antimicrobial efficacy at reduced concentrations, providing a stable and controlled release, and is formulated with typical hydrocolloid materials to create a skin-friendly, antimicrobial pressure-sensitive adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high concentrations of antimicrobial agents are used in adhesives, then antimicrobial efficacy is improved, but adverse effects on the wound bed and emergence of resistant pathogens worsen
Solution Approach 1:
The patent changes the concentration parameter of peroxide from high (traditional) to low (0.01-2% range), achieving effective antimicrobial activity at reduced concentrations through the synergistic combination of multiple peroxide species and controlled release mechanisms
Solution Approach 2:
The adhesive comprises a composite formulation containing multiple peroxide species (hydrogen peroxide, organic peroxides, peracids) combined with stabilizers and wound care agents, creating a multi-component system that enhances antimicrobial efficacy while reducing individual component concentrations and associated adverse effects
2Reliability
If hydrogen peroxide is used as an antimicrobial agent, then antimicrobial activity is improved, but stability of the peroxide worsens leading to ineffective infection control
Solution Approach 1:
The patent introduces stabilizers as intermediary substances that mediate between the peroxide species and the environment, protecting the peroxides from premature decomposition while allowing controlled release of antimicrobial activity over time
Solution Approach 2:
The patent changes the physical and chemical parameters of peroxide delivery by incorporating multiple peroxide species with different stability profiles and half-lives, creating a sustained release effect that maintains antimicrobial activity throughout the adhesive's wear period
3Reliability
If peroxide is applied to open wounds, then antimicrobial effect is improved, but deleterious effects on healing tissue worsen
Solution Approach 1:
The patent reduces the concentration parameter of peroxide in the adhesive formulation to 0.01-2%, significantly lower than traditional applications, thereby achieving effective antimicrobial activity while minimizing cytotoxic effects on healing tissue
Solution Approach 2:
The patent implements periodic or controlled release of peroxide through the adhesive system, providing intermittent antimicrobial action that maintains efficacy while allowing tissue recovery periods, reducing cumulative toxic exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive effectively reduces microbial proliferation, minimizes bioburden, promotes wound healing, and creates a hygienic environment by maintaining antimicrobial efficacy while reducing adverse effects, as demonstrated by full kill of E. coli and MRSA bacteria in tests.
Implementation Method 1
a super absorbent material chemically bonded either directly or indirectly to a peroxide, wherein the peroxide is within the hydrocolloid
Implementation Method 2
the hydrocolloid may be capable of absorbing liquid and forming a gel matrix
Implementation Method 3
these stabilized and active peroxide species can be formulated with typical hydrocolloid materials to produce skin friendly pressure sensitive adhesives to minimize the bioburden within the adhesive
Data Source
AI summary
This disclosure provides a hydrocolloid having a super absorbent material chemically bonded either directly or indirectly to a peroxide. The peroxide is within the hydrocolloid and the peroxide is in an amount of 0.05% to 2% by weight within the hydrocolloid.


