Serial Bus Interface for Multi-Die Module Interconnect

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Solution Overview

Problem

Modern RF electronic circuits face challenges in efficiently interconnecting multiple integrated circuits within a circuit module due to tortuous routing of signal lines, which can lead to isolation concerns and inefficiencies, especially when handling high-frequency signals.

Innovation Solution

The solution involves configuring multiple ICs within a multi-IC module to appear as a single addressable slave device on a serial bus, using a dynamic address translation architecture or internal parallel/serial configurations, allowing for efficient interconnect layouts without requiring multiple control/status connections per module, thus enabling straightforward signal routing and preventing bus contention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If multiple ICs are interconnected within a circuit module using traditional routing, then each IC can be connected to external circuit elements, but the signal lines become tortuous with different lengths and spacing, leading to isolation concerns and routing inefficiencies

Engineering Contradiction:
Improveinterconnect layoutVSAvoidsignal isolation
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A serializer IC is introduced as an intermediary device between the parallel bus and the external circuit elements. The serializer converts parallel data from multiple ICs into serial form, eliminating the need for complex point-to-point routing between each IC and external elements. This mediator approach simplifies the interconnect layout while maintaining signal isolation through standardized serialization/deserialization interfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If multiple control/status connections are provided per module to support multiple ICs, then each IC can be independently controlled, but the device complexity and number of physical connections increase

Engineering Contradiction:
Improvecontrol capabilityVSAvoidnumber of connections
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple control/status connections are merged into a single parallel bus interface. The system combines multiple ICs behind a unified parallel bus architecture, where a single set of control lines can address and control multiple ICs simultaneously. This merging approach reduces the number of physical connections while maintaining the ability to independently control each IC through address decoding logic.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The parallel bus interface is designed with universal addressing capability that can control multiple different IC types through a single interface. The control mechanism is made multi-functional by implementing address decoding that routes control signals to the appropriate IC based on its assigned address, allowing one control interface to serve multiple purposes and multiple ICs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of information

If traditional parallel bus architecture is used to connect multiple ICs, then control and status information can be exchanged, but the routing becomes complex and signal integrity deteriorates at high frequencies

Engineering Contradiction:
Improvecontrol and status informationVSAvoidsignal integrity
Core Design Contradiction:
Loss of informationVSReliability

Solution Approach 1:

The traditional parallel bus mechanical routing system is replaced with a serialization-based approach. Instead of physically routing multiple parallel signal lines through complex traces, the system converts parallel data to serial form, which can be transmitted through simpler, more controlled impedance paths. This substitution of the signaling mechanism improves signal integrity at high frequencies while maintaining full control and status information exchange capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS10210130B2Serial-bus interface for multi-die module
Publication Date: 2019.02.19 PSEMI CORP
  • US10210130B2 patent drawing
  • US10210130B2 patent drawing
  • US10210130B2 patent drawing

AI summary

Circuits and methods for efficient interconnect layout of multiple circuit elements, including integrated circuits (ICs), within a circuit module, while enabling only a single control/status (C/S) connection per module. In a first embodiment, the C/S interfaces of multiple ICs are configured in parallel within a multi-IC module, and coupled through a single module serial bus to a system C/S serial bus. In a second embodiment, the C/S interface of a primary IC is coupled through a single module serial bus to a system C/S serial bus, while a secondary IC is internally serially coupled to a “pass through” interface of the primary IC. In a third embodiment, a dynamic address translation circuit translates device and register address information provided by a master device into corresponding internal addresses, and re-directs command messages from a system C/S serial bus to internal slave devices.