Serial Interface for Semiconductor Package Using Differential Signaling
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Solution Overview
Problem
Current communication methods for semiconductor packages, such as NAND flash devices, face challenges in achieving high-speed data transfer while minimizing power consumption and managing electromagnetic interference, especially in applications like SSDs where existing parallel bus connections increase capacitive load and power consumption.
Innovation Solution
Implementing a serializer/deserializer (Ser/Des) technique with differential signaling protocols that embed a clock signal within the data stream, allowing for high-speed serial connections between a controller and semiconductor packages, reducing the pin count, and using a bridge device to manage communication between multiple die, thereby maintaining low power consumption and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a parallel bus connection is used to connect multiple die to the controller, then communication capability is improved, but power consumption increases due to increased capacitive load
Solution Approach 1:
The patent replaces the parallel bus connection (electrical/multi-signal system) with a serial connection (single-bit electrical system). This substitution reduces the capacitive load on controller pins by using fewer physical connections, thereby lowering power consumption while maintaining communication capability through high-speed serial protocols.
Solution Approach 2:
The patent changes the communication protocol parameters from parallel (multiple simultaneous signals) to serial (single bit stream). By transforming the data transmission mode and using differential signaling, the system achieves high-speed communication with reduced capacitive load and lower power consumption.
2Productivity
If a parallel bus connection is used to connect multiple die to the controller, then communication capability is improved, but operating frequency decreases due to increased capacitive load
Solution Approach 1:
The patent replaces the parallel bus connection with a serial connection, eliminating the capacitive load issues that limit operating frequency in parallel systems. The high-speed serial protocol enables higher operating frequencies by using a single differential signal pair instead of multiple parallel signals.
3Reliability
If on die termination (ODT) is implemented to maintain signal integrity, then signal quality is improved, but power consumption increases
Solution Approach 1:
The patent replaces the parallel bus system requiring ODT with a differential serial connection. The differential signaling inherently provides noise immunity and signal integrity without requiring additional termination resistors, thereby eliminating the power consumption associated with ODT while maintaining or improving signal quality.
4Use of energy by moving object
If existing serial protocols (MMC, SPI) are used for communication, then power consumption is reduced, but communication speed is limited for high speed applications
Solution Approach 1:
The patent changes the serial protocol parameters by implementing a high-speed differential serial connection with rates of 10 MT/s or more. This exceeds the capabilities of standard MMC and SPI protocols while maintaining the power efficiency benefits of serial communication, making it suitable for high-speed applications like SSDs.
5Productivity
If multiple IC packages are connected in parallel to the controller, then communication capability is improved, but pin count of the controller increases
Solution Approach 1:
The patent replaces parallel connections requiring multiple pins with a serial connection using a single differential signal pair. This substitution dramatically reduces the pin count required per IC package while maintaining communication capability through high-speed serial protocols.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-speed communication with reduced power consumption and improved noise resistance, supporting extended distances and complex topologies, while simplifying the controller design and reducing manufacturing costs by minimizing the pin count and interface complexity.
Implementation Method 1
a serializer/deserializer (Ser/Des) technique is implemented. For example, the plurality of die are connected in parallel to a parallel interface of a bridge device, and the bridge device implements a serial connection with the controller via a serial interface
Implementation Method 2
The signaling protocol may specify including a clock signal embedded in a data stream, rather than using an external clock signal... The signaling protocol may implement a low voltage protocol, and both the signaling protocol and other protocols may provide for improved power management techniques
Data Source
AI summary
A system for serial communication includes a controller, a semiconductor package comprising a plurality of semiconductor die, and a serial interface configured to connect the plurality of semiconductor die to the controller. The serial interface includes a controller-to-package connection and a package-to-controller connection, and the serial interface is configured to employ a signaling protocol using differential data signaling with no separate clock signals.