Serial I/O Wrapper Control for Smaller Semiconductor Pads
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Solution Overview
Problem
The increasing complexity of input/output (I/O) functions in semiconductor devices leads to larger chip sizes due to the need for complex control signals, which complicates the integration density of semiconductor devices.
Innovation Solution
The semiconductor device employs a series of IO wrappers and an IO controller to efficiently transfer control signals and clock signals, forming a control signal transfer loop and clock signal transfer loop, reducing the number of lines required for signal transfer and improving integration density by serially connecting the wrappers and providing shift input signals synchronized with clock signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional functions are provided to IO PAD (such as adjustment of input/output resistance, level adjustment, slew rate adjustment), then the functionality and versatility of the semiconductor device is improved, but the chip size increases due to complex control signals
Solution Approach 1:
Multiple control signals (first control signal for input/output resistance adjustment, second control signal for level adjustment, third control signal for slew rate adjustment) are merged into a single composite control signal that is transmitted through one dedicated control line from the I/O controller to the I/O pad, thereby reducing the number of control lines and chip area
Solution Approach 2:
The I/O pad is designed to perform multiple functions (input/output resistance adjustment, level adjustment, slew rate adjustment) through a single unified control mechanism, allowing one I/O pad structure to handle various adjustment functions without requiring separate dedicated control lines for each function
2Adaptability or versatility
If complex control signals are used to provide multiple functions to IO PAD, then the versatility of the device is improved, but the device complexity increases
Solution Approach 1:
An I/O controller is introduced as an intermediary component that generates and processes multiple control signals, combining them into a single composite control signal that simplifies the interface between the controller and the I/O pad while maintaining the capability to perform multiple functions
Solution Approach 2:
The control functionality is segmented into distinct control signals (first control signal for resistance, second for level, third for slew rate) that are generated separately but combined into a unified control mechanism, allowing independent control of each function while reducing overall system complexity
Data Source
AI summary
A semiconductor device include a first wrapper including a first scan flip-flop, first control flip-flops and a first pad, the first scan flip-flop receiving a first value and second values and storing the second value for determining a function of the first pad; a second wrapper including a second scan flip-flop, second control flip-flops and a second pad, the second scan flip-flop receiving the first value from the first wrapper and storing the first value for determining a function of the second pad; and an input/output controller configured to provide a shift input signal having the first and second values to the first wrapper.