Serial RFID Tag Wafer Testing Probe
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Solution Overview
Problem
Manufacturing and testing RFID tags in a high-volume and cost-effective manner is challenging due to the lack of a power source in RFID tags, requiring efficient methods to energize and retrieve information from them.
Innovation Solution
A semiconductor wafer testing system with a test probe and probe pads that transmit power, control, and data signals to each RFID die in a serial manner, allowing for the testing and separation of RFID tags without damaging them, using conductive lines and power planes to facilitate signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If RFID tags are tested using conventional methods, then testing can be performed, but the lack of power source in RFID tags makes high-volume and cost-effective manufacturing challenging
Solution Approach 1:
The system segments the testing process by dividing the wafer into multiple dies, with each die containing multiple RFID tags that can be tested independently through conductive lines. This allows parallel testing of multiple tags simultaneously, increasing throughput while maintaining cost-effectiveness through efficient resource utilization.
Solution Approach 2:
The test probe structure serves multiple functions: it provides power to RFID tags without internal power sources, transmits test signals, receives responses, and enables high-volume testing. This multi-functional design eliminates the need for separate power supply equipment and testing apparatus, reducing manufacturing costs while maintaining high productivity.
2Reliability
If power is transmitted to energize RFID tags during testing, then information can be retrieved from tags, but efficient power and signal transmission to multiple dies requires complex probe structures
Solution Approach 1:
The patent merges power transmission lines and data signal lines into an integrated probe structure. The conductive lines serve dual purposes of providing power and transmitting data signals simultaneously, reducing the number of separate components needed while ensuring reliable power and signal delivery to multiple RFID tags during testing.
Solution Approach 2:
The conductive lines act as intermediaries between the test probe and RFID tags, facilitating both power and data transmission. These intermediary elements enable reliable communication and energy transfer without requiring direct complex connections, simplifying the overall system architecture while maintaining transmission reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective testing of RFID tags by ensuring reliable power and signal transmission to each die, allowing for accurate testing and separation without damage, thereby improving the manufacturing process.
Implementation Method 1
The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies
Implementation Method 2
a 'base station' or 'reader' sends an excitation signal to an RFID tag. The excitation signal energizes the RFID tag, and the RFID tag transmits the stored information back to the reader
Data Source
AI summary
A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.