Series Capacitor Electrode Layout for Stable High-Frequency ESR
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Solution Overview
Problem
Conventional electronic components with capacitor portions connected in series face challenges in reducing short-circuit failures and stabilizing ESR on the high-frequency side due to internal electrode lamination orientation and terminal electrode placement, leading to performance limitations.
Innovation Solution
The electronic component design includes internal electrodes laminated orthogonal to the mounting surface with terminal electrodes on the main surface, allowing for series connection of capacitor portions and external conductor integration to inspect short-circuit failures and reduce ESL, while notch portions and external conductors enhance mechanical strength and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If internal electrodes are laminated in a direction parallel to the mounting surface, then the manufacturing process is simple, but short-circuit failures increase and high-frequency ESR stability deteriorates
Solution Approach 1:
The patent changes the lamination direction of internal electrodes from parallel to the mounting surface (conventional) to orthogonal to the mounting surface (invention). This dimensional change in electrode arrangement allows capacitor portions to be connected in series while reducing short-circuit failures and stabilizing high-frequency ESR, without significantly complicating the manufacturing process
2Reliability
If terminal electrodes are formed on end surfaces, then series connection of capacitor portions is achieved, but ESL increases and mechanical strength decreases
Solution Approach 1:
The patent positions terminal electrodes on the main surface (mounting surface) rather than on end surfaces. This spatial reconfiguration, combined with orthogonal lamination of internal electrodes, reduces the current path length and minimizes ESL while maintaining the series connection capability of multiple capacitor portions
3Reliability
If terminal electrodes are formed on end surfaces, then series connection is achieved, but bending stress and mechanical strength worsen
Solution Approach 1:
The patent relocates terminal electrodes from end surfaces to the main surface, and changes internal electrode lamination from parallel to orthogonal relative to the mounting surface. This reconfiguration shortens the distance between terminal electrodes and distributes mechanical stress more evenly, reducing bending stress and improving overall mechanical strength while preserving series connection functionality
4Ease of manufacture
If internal electrodes are laminated parallel to mounting surface, then manufacturing is easier, but high-frequency ESR stability deteriorates
Solution Approach 1:
The patent implements orthogonal lamination of internal electrodes relative to the mounting surface, changing the conventional parallel arrangement. This dimensional change in electrode orientation creates a more stable current distribution pattern that minimizes variations in high-frequency ESR, improving stability without significantly affecting manufacturing complexity
Data Source
AI summary
An electronic component includes: a first internal electrode which is provided inside an element body and is drawn on a first main surface corresponding to a mounting surface; a second internal electrode which is provided inside the element body, is provided at a position different from the first internal electrode when viewed from a third direction, and is drawn on the first main surface; a third internal electrode which is provided inside the element body, is provided at a position facing the first internal electrode and the second internal electrode in the third direction, and is drawn on the first main surface; wherein the first internal electrode and the third internal electrode face each other in the third direction to form a first capacitor portion, and wherein the second internal electrode and the third internal electrode face each other in the third direction to form a second capacitor portion.