Series-Connected Heat Sink Modules Using Two-Phase Bubbly Flow Cooling
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Solution Overview
Problem
Current cooling systems for electronic devices, such as microprocessors, are inefficient and unable to manage the high heat loads of next-generation components, leading to increased energy consumption and operational challenges due to limitations in air cooling and liquid cooling methods.
Innovation Solution
A cooling apparatus using two series-connected heat sink modules with a flow of single-phase liquid coolant that vaporizes to form two-phase bubbly flow, allowing for efficient heat transfer and management of high heat fluxes by maintaining a lower temperature at the second heat-providing surface compared to the first, utilizing dielectric coolants like HFE-7000 or R-245fa.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If air cooling systems are used to cool electronic devices, then the devices can be cooled without additional liquid cooling infrastructure, but the cooling efficiency is limited due to the low volumetric heat capacity of air requiring very high flow rates
Solution Approach 1:
The patent transitions from air cooling (pneumatic) to liquid cooling (hydraulic) systems. Liquid coolants with higher volumetric heat capacity are used to transport heat away from electronic devices, enabling efficient cooling at lower flow rates compared to air cooling systems
Solution Approach 2:
The patent changes the physical parameter of the cooling medium from gas (air) to liquid, exploiting the higher heat capacity of liquids to improve cooling efficiency and reduce the energy required for heat removal
2Loss of energy
If liquid cooling systems are implemented, then cooling efficiency improves due to higher volumetric heat capacity, but system complexity increases and requires additional infrastructure
Solution Approach 1:
The patent divides the cooling system into modular components including heat sinks, coolant distribution manifolds, and independent cooling zones. This segmentation allows the liquid cooling system to be implemented in a structured, manageable way that reduces overall system complexity
Solution Approach 2:
The patent designs a liquid cooling system that can serve multiple electronic devices and heat-generating components simultaneously through a unified coolant distribution network, reducing the need for separate cooling infrastructure for each device
3Temperature
If high flow rates are used in air cooling systems to manage heat loads, then adequate cooling is achieved, but the system becomes noisy and consumes more energy
Solution Approach 1:
The patent replaces high-speed fan-driven air cooling with pump-driven liquid cooling systems. The liquid coolant efficiently absorbs heat at lower flow rates, reducing fan speed requirements and associated power consumption and noise
Solution Approach 2:
The patent utilizes phase change cooling where the coolant absorbs latent heat during phase transition (evaporation or boiling), providing intensive cooling at low flow rates and reducing the energy required for heat removal compared to sensible heating in air cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces power consumption and enhances cooling efficiency, enabling the operation of electronic devices at lower temperatures and handling high heat loads effectively, thus addressing the limitations of existing cooling systems.
Implementation Method 1
A first amount of heat is transferred from the first heat-providing surface to the single-phase liquid coolant resulting in vaporization of a portion of the single phase liquid coolant thereby changing the flow of single-phase liquid coolant to two-phase bubbly flow
Implementation Method 2
A first amount of heat is transferred from the first heat-providing surface to the single-phase liquid coolant
Implementation Method 3
transporting the two-phase bubbly flow from an outlet port of the first heat sink module to an inlet port of a second heat sink module
Implementation Method 4
A second amount of heat can be transferred from the second heat-providing surface to the two-phase bubbly flow resulting in vaporization of a portion of the liquid coolant within the two-phase bubbly flow
Implementation Method 5
resulting in a change from the first quality to a second quality
Implementation Method 6
The energy from the first amount of heat and the second amount of heat can be stored, at least in part, as latent heat in the two-phase bubbly flow and transported out of the server
Data Source
AI summary
A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.