Series-Connected Semiconductor Laser Array Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor light emitting devices with high output and reliability face issues such as heat management and load concentration due to insulation methods and parallel connection of semiconductor laser elements, leading to temperature increases and reliability declines.
Innovation Solution
A semiconductor light emitting device with a mount section and heat radiation block having metal wirings that connect semiconductor laser elements in series, allowing for efficient heat dissipation and reducing load concentration by positioning active layers close to the heat sink, thereby improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If semiconductor laser elements are connected in parallel to provide high output, then the light output intensity increases, but load concentration occurs on individual elements leading to reduced reliability
Solution Approach 1:
The invention divides the single high-power laser element into multiple lower-power laser elements (first and second laser elements) that operate in parallel. Each element handles a portion of the total load, preventing any single element from experiencing excessive current density and heat generation, thereby improving overall system reliability while maintaining high light output intensity.
2Reliability
If element separation grooves are used to electrically insulate semiconductor laser elements, then electrical insulation is achieved, but the insulation structure becomes complex and manufacturing difficulty increases
Solution Approach 1:
The invention extracts the insulation function from the substrate structure and relocates it to the mount section. The mount section with its insulating layer and conductive patterns provides the necessary electrical insulation between the first and second laser elements, eliminating the need for complex element separation grooves in the substrate while maintaining effective electrical isolation.
3Ease of manufacture
If active layers are positioned away from heat sink for proper electrical connection, then electrical connection is simplified, but heat generated in active layers cannot be efficiently dissipated
Solution Approach 1:
The invention transitions from a planar mounting approach to a three-dimensional stacked configuration. The active layers are positioned on the upper surfaces of the laser elements, while the mount section with heat dissipation structures is positioned below. This vertical arrangement allows efficient heat conduction from the active layers through the mount section to the heat sink, while maintaining simplified electrical connections through conductive patterns on the mount section.
4Temperature
If multiple semiconductor laser elements are used to disperse heat, then heat dissipation improves, but the device structure and wiring complexity increases
Solution Approach 1:
The invention merges the heat dissipation function with the electrical connection function into a single integrated mount section. The mount section contains both the insulating layer for electrical isolation and conductive patterns that provide both electrical connections and thermal conduction pathways. This integration eliminates the need for separate wiring structures and complex heat sink arrangements, simplifying the overall device structure while achieving effective heat dissipation from multiple laser elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature increases and enhances the reliability of semiconductor light emitting devices during high-output operations by efficiently dispersing heat and maintaining consistent electrode polarity, improving both heat management and optical coupling efficiency.
Implementation Method 1
heat generated in the plurality of semiconductor laser elements is efficiently dispersed to the heat sink
Implementation Method 2
a first wiring made of a metal is formed on an upper surface of the mount section, and a second wiring made of a metal is formed on a lower surface of the heat radiation block, a part of the second wiring being electrically connected to the first wiring
Data Source
AI summary
A semiconductor light emitting device includes a mount section having an insulating property connected to a heat sink, a plurality of semiconductor laser elements disposed on the mount section, and a heat radiation block having an insulating property disposed on the plurality of semiconductor laser elements. A first wiring made of a metal is disposed on an upper surface of the mount section, and a second wiring made of a metal is disposed on a lower surface of the heat radiation block, a part of the second wiring being electrically connected to the first wiring. By electrically connecting the first wiring and the second wiring to each of the plurality of semiconductor laser elements, the plurality of semiconductor laser elements are connected in series, and have a same polarity with each other at a side that each of the plurality of semiconductor laser elements is connected to the first wiring.