Series-Connected LED Cells on Single Substrate for High-Voltage Illumination
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Solution Overview
Problem
Conventional light emitting diode (LED) manufacturing for general illumination involves complex and error-prone metal wiring processes, leading to increased processing steps, defects, and large device sizes, which hinder mass production and are not suitable for high-voltage applications.
Innovation Solution
A light emitting element with multiple cells connected in series or parallel on a single substrate, using N-type and P-type semiconductor layers and metallic wires for electrical connection, along with a rectifying bridge unit and electrodes for power application, simplifying the manufacturing process and enabling high-voltage operation with a single chip type light emitting element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple light emitting elements are serially connected with separate packaging, then the light emitting device can achieve general illumination function, but the manufacturing process becomes complex and the device size becomes large
Solution Approach 1:
Multiple light emitting cells are integrated onto a single substrate to form one light emitting element, combining what were previously separate packaged elements into a unified structure. This reduces the number of discrete components and simplifies the overall manufacturing process while maintaining the required illumination capability.
Solution Approach 2:
The light emitting element is divided into multiple cells that can be independently formed on the substrate through sequential epitaxial growth, allowing each cell to be optimized separately while being manufactured in an integrated process on a single chip.
2Reliability
If metal wiring process is used to connect light emitting chips, then electrical connection is achieved, but the processing steps increase and fraction defective increases
Solution Approach 1:
Electrical connections between light emitting cells are established during the epitaxial growth process itself, rather than requiring subsequent metal wiring steps. The n-type and p-type contact layers are formed in advance as part of the semiconductor layer structure, eliminating the need for post-growth wiring operations.
Solution Approach 2:
The mechanical metal wiring process is replaced by direct semiconductor layer formation through epitaxial growth. Instead of physically attaching metal wires to connect cells, the electrical connection is achieved through the inherent conductivity of the sequentially grown n-type and p-type layers that form continuous conductive paths.
3Power
If light emitting elements are arrayed in series, then the required voltage for general illumination is achieved, but the space occupied is expanded
Solution Approach 1:
Multiple light emitting cells are arranged in a planar array on the substrate surface rather than stacking them vertically or connecting separate packaged elements in three-dimensional space. This two-dimensional integration reduces the overall device footprint while achieving the required series connection voltage through the arrangement of multiple cells on the same plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces defects, and allows for mass production of light emitting devices capable of high-voltage operation using a single chip type light emitting element, enhancing light emitting efficiency and protecting the LED array.
Implementation Method 1
A light emitting diode refers to an element in which minority carriers (electrons or holes) injected using a p-n junction structure of a semiconductor are produced and certain light is emitted through recombination thereof
Implementation Method 2
a wire for connecting the N-type semiconductor layer of one light emitting cell to the P-type semiconductor layer of another adjacent light emitting cell
Data Source
AI summary
The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.