Series-Stacked Semiconductor Structure for High-Voltage Area Reduction
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Solution Overview
Problem
Semiconductor devices with high breakdown voltage require multiple elements connected in series, which can occupy a large mounting area on a circuit board when arranged in a plane.
Innovation Solution
A semiconductor device design that includes multiple semiconductor elements connected in series, with an insulating member and control terminals, allowing for efficient packaging and reduced mounting area by arranging elements in a specific direction and using a resin-based insulating structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple semiconductor elements are connected in series to achieve high breakdown voltage, then the breakdown voltage is improved, but the mounting area on the circuit board increases
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacked arrangement of semiconductor elements. Multiple semiconductor elements are vertically stacked with insulating members between them, utilizing the vertical dimension (Z-axis) rather than expanding horizontally. This dimensional change allows series-connected elements to occupy significantly reduced mounting area while maintaining the required breakdown voltage through vertical stacking.
2Reliability
If multiple semiconductor elements are arranged in a plane to achieve high breakdown voltage, then the breakdown voltage is improved, but the device complexity increases
Solution Approach 1:
The patent divides the high-voltage semiconductor device into multiple discrete semiconductor elements connected in series, with each element handling a portion of the total voltage. Insulating members are segmented and placed between individual elements. This segmentation allows modular assembly and simplifies the overall structure compared to attempting to create a single high-voltage element, as each component can be optimized independently and assembled systematically.
Data Source
AI summary
A semiconductor device includes semiconductor elements, an insulating member, first and second terminals and control terminals. The semiconductor elements each include a semiconductor part, a first electrode on the back surface of the semiconductor part, a second electrode and a control electrode on the front surface thereof. The semiconductor elements are electrically connected in series and include first-end and second-end semiconductor elements each provided at an end of the series connection. The insulating member seals the semiconductor elements and includes a first surface and a second surface opposite to the first surface. The first and second terminals are electrically connected to the first electrode of the first-end semiconductor element and the second electrode of the second-end semiconductor element, respectively. Each control terminal is electrically connected to the control electrode. The second and control terminals are provided at one of the first or second surface side of the insulating member.