Semiconductor Inductor with Serpentine Core and Wire

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Solution Overview

Problem

Existing methods for forming semiconductor inductors are inadequate for minimizing circuit board space in hand-held devices, as they do not effectively integrate inductors onto chips while maintaining sufficient inductance and frequency characteristics.

Innovation Solution

A semiconductor inductor design featuring a serpentine-shaped conductive wire woven through a serpentine-shaped ferromagnetic core, with laminated magnetic material to reduce eddy currents and adjust inductance values, is developed. The method involves depositing magnetic materials and forming a conductive wire structure using electroplating and photoimageable epoxy layers to create a compact, high-inductance inductor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If inductors are implemented as stand-alone devices, then inductance and stored energy are sufficient, but circuit board space consumption increases significantly

Engineering Contradiction:
Improvecircuit board spaceVSAvoidinductance performance
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent merges the inductor with the semiconductor chip by integrating the ferromagnetic core and conductive wire directly onto the chip substrate. The core is formed as a planar structure with copper traces winding through it, creating a unified chip-inductor component that eliminates the need for separate stand-alone inductor devices, thereby reducing circuit board space while maintaining inductance performance

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from traditional three-dimensional coil structures to a planar two-dimensional configuration. The ferromagnetic core and conductive traces are arranged in a flat, layered structure on the chip surface, allowing the inductor to be integrated into the chip plane without requiring vertical space, thus minimizing circuit board footprint while preserving magnetic flux path efficiency

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional semiconductor inductor techniques are used, then integration onto chip is achieved, but inductance and frequency characteristics are insufficient

Engineering Contradiction:
Improveinductance and frequency characteristicsVSAvoidinductor structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a composite structure combining ferromagnetic material for the core with copper conductive traces wound through it. This composite design provides both the magnetic properties necessary for high inductance and the electrical conductivity required for signal transmission, achieving superior inductance and frequency characteristics compared to conventional single-material semiconductor inductor techniques

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent utilizes serpentine-shaped curved traces instead of straight linear paths. The winding copper traces follow curved paths through the ferromagnetic core, creating multiple turns that increase the magnetic flux linkage and thereby enhancing inductance. The curved geometry allows efficient use of the planar space while maximizing the magnetic path length

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Reliability

If ferromagnetic core is used to increase inductance, then stored energy increases, but eddy currents increase causing degraded frequency characteristics

Engineering Contradiction:
Improveinductance and stored energyVSAvoideddy currents
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The ferromagnetic core is divided into multiple laminated layers with insulating barriers between them. This segmentation breaks up the continuous conductive path that would allow large eddy currents to flow, restricting eddy currents to smaller loops within each layer. The laminated structure maintains the magnetic flux path for high inductance while suppressing harmful eddy current losses, thereby improving frequency characteristics

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The serpentine design provides a low reluctance flux path, allows for easy adjustment of inductance, and reduces eddy currents, thereby enhancing frequency characteristics and minimizing circuit board space requirements.

Implementation Method 1

The serpentine shape of the ferromagnetic core ensures a low reluctance flux path within the ferromagnetic core

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

laminated magnetic material to reduce eddy currents and adjust inductance values

Methodology Applied
Scientific EffectEddy currents: Eddy Currents

Data Source

PatentUS8338913B2Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core
Publication Date: 2012.12.25 NAT SEMICON CORP
  • US8338913B2 patent drawing
  • US8338913B2 patent drawing
  • US8338913B2 patent drawing

AI summary

The inductance of an inductor is increased by forming a conductive wire to have a serpentine shape that weaves through a ferromagnetic core that has a number of segments that are connected together in a serpentine shape where each segment of the ferromagnetic core also has a number of sections that are connected together in a serpentine shape.