Server Cabinet Heat Dissipation Device Angled Stacking
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Solution Overview
Problem
Conventional heat dissipation devices in server cabinets experience reduced heat dissipation efficiency due to limited space and increased temperature when wind passes through multiple devices in parallel, leading to decreased overall cooling effectiveness.
Innovation Solution
The design includes an outer case with vent holes and fans, featuring multiple heat dissipation devices arranged at specific angles (V-shaped, inverted V-shaped, W-shaped, or M-shaped) with water inlet and outlet parts connected through fins and air ducts, ensuring optimal airflow and heat transfer without temperature differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple heat dissipation devices are arranged horizontally in parallel to improve heat dissipation capacity, then the heat dissipation capacity is enhanced, but the temperature of air increases when passing through multiple devices, reducing overall heat dissipation efficiency
Solution Approach 1:
The patent transitions from horizontal parallel arrangement to vertical stacked arrangement of heat dissipation devices. This dimensional change allows air to flow vertically through multiple devices in sequence, with each device processing progressively cooler air from the bottom, thereby maintaining temperature gradient and heat dissipation efficiency while increasing overall capacity.
Solution Approach 2:
The patent introduces asymmetric angle adjustments between adjacent heat dissipation devices, where each device is rotated at a specific angle relative to the previous one. This asymmetric configuration optimizes airflow patterns and prevents thermal interference between devices, allowing each device to operate in its optimal temperature range while maintaining high heat dissipation capacity.
2Power
If multiple heat dissipation devices are arranged in limited space, then the heat dissipation capacity is increased, but the space for interior decoration is reduced
Solution Approach 1:
By stacking heat dissipation devices vertically rather than arranging them horizontally, the patent充分利用 the vertical dimension of the limited space. This allows multiple devices to be accommodated within the same horizontal footprint, significantly increasing heat dissipation capacity without reducing the usable interior horizontal space for other components.
Solution Approach 2:
The patent implements a compact stacked configuration where heat dissipation devices are nested vertically within the confined space of the server cabinet. Each device is positioned to utilize the vertical space efficiently, creating a space-optimal arrangement that maximizes heat dissipation capacity within the limited interior volume.
3Device complexity
If heat dissipation devices are arranged horizontally in parallel, then the configuration is simple, but the heat dissipation effect is reduced due to temperature increase
Solution Approach 1:
The vertical stacking configuration, while introducing angular adjustments, creates a more efficient heat dissipation system. The increased heat dissipation effect compensates for the moderate increase in configuration complexity, as the vertical arrangement with angle optimization directly addresses the temperature buildup issue that plagues horizontal arrangements.
Solution Approach 2:
The asymmetric angle adjustment between devices, while adding some configurational complexity, significantly improves heat dissipation effectiveness by optimizing airflow and temperature distribution. This controlled complexity yields substantial performance gains that far exceed the minor increase in configuration effort.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by preventing temperature increase and maintaining efficient airflow, resulting in improved overall heat dissipation performance compared to conventional technologies.
Implementation Method 1
Liquid is used as a heat dissipation medium to circulate in the form of cold and heat exchange. The liquid with a relatively low temperature absorbs heat energy when it flows through an electronic component with a relatively high temperature, and then conducts heat exchange in a cooling device to release the heat energy.
Implementation Method 2
The fans 11 is used to let the wind enter the case1 from the outside and then be discharged, and the wind in the case 1 will pass through the first heat dissipation device 12, and take away the heat energy to achieve cooling effect.
Implementation Method 3
the water inlet part is fixed with a plurality of first fins, and the water outlet part is fixed with a plurality of second fins
Data Source
AI summary
A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.