Liquid-Cooled Server Cabinet Rack Layout for Dense Heat Dissipation
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Solution Overview
Problem
Existing liquid cooling systems for data processing devices fail to effectively dissipate heat due to high device density, leading to elevated operating temperatures and increased malfunction rates.
Innovation Solution
A liquid cooling apparatus with a unique rack configuration that includes first and second racks for servers and power distribution units, respectively, arranged along a horizontal direction, with spaced mounting positions and openwork structures to enhance air convection and reduce heat concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If data processing devices are densely packed to increase computing power, then hardware infrastructure scale is expanded, but heat dissipation becomes insufficient and operating temperature rises
Solution Approach 1:
The liquid cooling cabinet is divided into multiple independent cooling modules, each capable of cooling specific device groups. This segmentation allows targeted heat removal from high-temperature zones while maintaining high device density, resolving the contradiction between computing power and heat dissipation capacity.
Solution Approach 2:
A liquid cooling system with cooling plates and fluid circulation acts as an intermediary between heat-generating devices and the external environment. The cooling fluid serves as a heat transfer medium that efficiently carries heat away from densely packed devices, enabling high density without temperature rise.
2Temperature
If cooling systems are added to reduce operating temperature, then heat dissipation is improved, but device density and space utilization are reduced
Solution Approach 1:
The cooling system components (cooling plates, fluid channels) are merged with the device mounting structure itself. The cooling plates are integrated into the chassis or mounting brackets, eliminating the need for separate cooling infrastructure and allowing high device density while maintaining effective cooling.
Solution Approach 2:
The cooling system utilizes a porous or mesh-like structure for heat exchange surfaces, allowing efficient heat transfer while maintaining compact form factor. This enables effective cooling without requiring large volumes of air circulation space, thus preserving high device density.
3Area of stationary object
If rows of chassis are arranged close to each other to maximize space utilization, then hardware infrastructure scale is expanded, but cooling effect is insufficient
Solution Approach 1:
The cooling system transitions from two-dimensional air cooling to three-dimensional liquid cooling by introducing vertical fluid circulation channels and multi-level cooling plates. This dimensional change allows heat removal from all surfaces of densely packed chassis rows simultaneously, maintaining high space utilization while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves heat dissipation by reducing device density and promoting air convection, thereby lowering operating temperatures and minimizing hardware malfunctions.
Implementation Method 1
Water from the liquid cooling system is supplied to these flow channel plates to carry away the heat generated within the data processing device
Implementation Method 2
the first rack and the second rack are provided with openwork structures respectively, and the openwork structures are used for enhancing air convection within the liquid cooling cabinets
Data Source
AI summary
Disclosed are a liquid cooling apparatus and a liquid-cooled container. The liquid cooling apparatus includes a liquid cooling cabinet, a server, and a power distribution unit. The liquid cooling cabinet includes a first side panel, a top plate, a second side panel, and a base plate that are sequentially connected to form a rectangular frame. A first rack is secured within the rectangular frame, wherein the first rack includes a first rack body and a second rack body. The first rack body is abutted against an inner wall of the first side panel, and the second rack body is spaced apart from the second side panel. A plurality of first mounting positions for accommodating the servers are arranged on the first rack in a vertical direction.