Server Chassis Air Baffle for Independent Heat Dissipation
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Solution Overview
Problem
Conventional server chassis designs compromise heat dissipation performance by coupling high-power supply modules with other components in shared air cavities, leading to heat accumulation and reduced cooling efficiency.
Innovation Solution
The server chassis incorporates a backplane with two isolated subboards and air baffles, creating separate air cavities for independent heat dissipation of high-power modules and power supply modules, allowing for optimized airflow and reduced heat accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the power supply air cavity shares heat dissipation space with the system air cavity, then the device complexity is reduced, but the heat dissipation performance deteriorates due to heat accumulation and reduced cooling efficiency
Solution Approach 1:
The patent divides the originally shared air cavity into two independent air cavities: a power supply air cavity and a system air cavity. This segmentation allows separate heat dissipation paths for power supply modules and system components, preventing heat accumulation and improving overall heat dissipation performance while maintaining reasonable structural complexity through modular design.
2Device complexity
If the power supply air cavity is coupled to the system air cavity, then the airflow path is simplified, but the heat dissipation capability is reduced due to sequential heat dissipation requirements
Solution Approach 1:
The patent segments the airflow path into two independent channels: one for the power supply air cavity and another for the system air cavity. This allows parallel heat dissipation operations rather than sequential processing, significantly improving heat dissipation capability while the airflow paths remain relatively simple and easy to implement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency for both high-power and power supply modules, improving the overall heat management and performance of the server.
Implementation Method 1
Heat of a high-power supply module (for example, the processor) needs to be dissipated first by using airflow, and then heat of another module (for example, a power supply) is dissipated by using the airflow
Data Source
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AI summary
This application provides a chassis of a server and a server. The chassis of the server comprises a backplane. The backplane is disposed in the chassis of the server, and the backplane includes a first subboard, a second subboard, and at least one air baffle. The first subboard is isolated from the second subboard. Each air baffle forms an included angle with the first subboard and forms an included angle with the second subboard. Space enclosed by the first subboard, the second subboard, and a side wall, an upper wall, and a lower wall of the chassis is divided into a first air cavity and at least one second air cavity by using the at least one air baffle. The first air cavity is used for at least one first module to dissipate heat, and the second air cavity is used for at least one second module to dissipate heat. This implements heat dissipation of the first module and the second module each by using an independent air cavity, and improves heat dissipation performance of the server.