Liquid-Cooled Server Chassis Layout for Leak-Protected Coolant Ports

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Solution Overview

Problem

Existing liquid cooling systems for supercomputing servers suffer from complex piping arrangements and inadequate reliability, leading to installation challenges and potential liquid leakage.

Innovation Solution

A simplified liquid cooling system with a chassis design that includes an accommodating space and protective space, featuring integrated coolant ports and connectors, and a liquid barrier strip to prevent leakage and enhance reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid cooling piping is used for heat exchange, then cooling effectiveness is improved, but piping arrangement complexity increases and reliability decreases

Engineering Contradiction:
Improvecooling effectivenessVSAvoidpiping arrangement complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the liquid cooling piping system with the chassis structure by integrating coolant ports directly into the side panels and using the side panels themselves as protective enclosures. This integration eliminates separate piping components and reduces the number of connection points, thereby simplifying the overall structure while maintaining effective heat exchange functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The side panels serve multiple functions: they provide structural support for the chassis, contain protective spaces that shield coolant ports, and directly incorporate the coolant ports themselves. This multi-functionality reduces the need for additional dedicated cooling components, simplifying the piping arrangement while ensuring reliable cooling.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If liquid cooling piping is used for heat exchange, then cooling effectiveness is improved, but reliability decreases due to potential liquid leakage

Engineering Contradiction:
Improvecooling effectivenessVSAvoidliquid leakage risk
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent incorporates protective spaces within the chassis side panels that surround and shield the coolant ports before any potential leakage can occur. These protective enclosures act as a first line of defense, containing any potential leaks within the chassis structure and preventing liquid from reaching external components or causing damage.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The side panels serve as an intermediary barrier between the coolant ports and the external environment. By routing coolant ports through the side panels and enclosing them within protective spaces, the side panels mediate the interaction between the cooling system and the chassis interior, isolating potential leakage sources from critical components.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If complex piping arrangement is used, then cooling coverage is improved, but installation difficulty increases

Engineering Contradiction:
Improvecooling coverageVSAvoidinstallation difficulty
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent segments the cooling system into modular components integrated into the chassis structure, with coolant ports distributed across different side panels. This segmentation allows for independent installation and configuration of cooling zones, simplifying the overall installation process while ensuring comprehensive cooling coverage across multiple server modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The chassis is pre-configured with integrated coolant ports and protective spaces during manufacturing, eliminating the need for complex field installation of piping systems. The side panels are designed with built-in cooling functionality, allowing installers to simply connect external coolant lines to the pre-positioned ports without dealing with complex routing or sealing requirements.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design ensures easy assembly, reduces the risk of leakage, and enhances operational reliability by protecting coolant ports and connectors within a protective space, while maintaining a simple overall structure.

Implementation Method 1

Liquid cooling is a method that utilizes a coolant to remove heat generated by numerous high-performance chips operating inside the supercomputing server, by means of heat exchange.

Methodology Applied
Scientific EffectHeat exchange: Convection

Data Source

PatentUS20250386463A1Supercomputing server and data center
Publication Date: 2025.12.18 BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
  • US20250386463A1 patent drawing
  • US20250386463A1 patent drawing
  • US20250386463A1 patent drawing

AI summary

Disclosed are a supercomputing server and a data center. The supercomputing server includes a chassis and a liquid-cooled module. The chassis includes a cover plate, a base plate, and a first side panel, a second side panel, a third side panel and a fourth side panel that are sequentially end-to-end connected. The side panels are connected to the base plate and extend from a same surface thereof to form an accommodating space with the base plate. The base plate, the second side panel, and the fourth side panel each extend beyond the first side panel to form a protective space. A first slot and a second slot are arranged in the first side panel. The cover plate covers the accommodating space. The liquid-cooled computing module has a first end wall, a first medium port, and a second medium port.