Server Chassis Cooling Units with Relocatable Frames

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Solution Overview

Problem

Current thermal management solutions for high power density electronics in server systems are not interoperable with diverse server system designs and peripheral PCB configurations, leading to inefficiencies in heat dissipation.

Innovation Solution

A server chassis design with a secured panel, adjustable frames, and relocatable cooling units that can interface with IT components, allowing for flexible positioning and easy servicing or replacement of cooling units within an electronic rack, supporting both air and liquid cooling methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If fixed cooling units are used in server systems, then cooling function is provided, but adaptability to diverse server system designs and peripheral PCB configurations is poor

Engineering Contradiction:

Improveadaptability to diverse server system designsVSAvoidcooling system configuration complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The cooling units are designed to be relocatable along the rear panel of the server chassis, allowing dynamic repositioning to accommodate different peripheral PCB configurations. The rear panel includes multiple mounting positions with standardized interfaces, enabling the cooling units to adapt to various server system designs without requiring complex custom installations for each configuration.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If multiple fixed cooling units are installed for different configurations, then coverage is improved, but device complexity and installation difficulty increase

Engineering Contradiction:

Improvecompatibility with peripheral configurationsVSAvoidinstallation and servicing ease

Core Design Contradiction:

Adaptability or versatilityVSEase of operation

Solution Approach 1:

A universal cooling unit design is implemented that can be positioned at multiple locations along the rear panel to serve different peripheral PCB configurations. The standardized mounting interfaces and relocatable design allow a single cooling unit type to fulfill multiple cooling needs across different server configurations, eliminating the need for specialized cooling units for each configuration and simplifying installation and servicing.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of repair

If cooling units are fixed in position, then structural stability is maintained, but hot-swappable capability and maintenance flexibility are lost

Engineering Contradiction:

Improvecooling unit replacement easeVSAvoidstructural stability

Core Design Contradiction:

Ease of repairVSReliability

Solution Approach 1:

The cooling system is segmented into modular cooling units that can be independently removed and replaced. Each cooling unit features standardized mounting interfaces that maintain structural stability when installed but allow easy removal and reinstallation. This segmentation enables hot-swappable capability where cooling units can be replaced without shutting down the server system, while the standardized interfaces ensure structural integrity is maintained during operation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances thermal management by enabling efficient cooling of IT components across different power densities and peripheral configurations, allowing for hot-swappable cooling units and improved airflow management, thus addressing the inefficiencies in existing systems.

Implementation Method 1

one or more cooling units attachable to the one or more frames, the one or more cooling units to interface with the one or more IT components to cool the one or more IT components

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

allowing for flexible positioning and easy servicing or replacement of cooling units within an electronic rack, supporting both air and liquid cooling methods

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

enhances thermal management by enabling efficient cooling of IT components across different power densities and peripheral configurations

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP4007466B1Server chassis design for high power density electronics thermal management

Publication Date: 2024.01.24 BAIDU USA LLC

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AI summary

A server chassis (203, 204, 1503) of an electronic rack is disclosed and includes a tray (310) to contain one or more IT components (309). The server chassis (203, 204, 1503) is stackable on an electronic rack, and has a top section (301) and the bottom section (303) including the tray (310). The top section (301) includes a secured panel (401) secured to the server chassis, one or more frames (403-405) adjustably attached to the secured panel (401), and one or more cooling units (701) attachable to the one or more frames (403-405). The one or more cooling units (701) to interface with the one or more IT components (309) to cool the one or more IT components (309), and the one or more frames (403-405) are relocatable to a different position on the secured panel (401).