Server Chassis Heat Dissipation Structure with Shared Thermal Module
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation structures in server mainframes increase the volume of the chassis, reducing the number of supported mainframes and compromising the heat dissipation efficiency within the internal space.
Innovation Solution
A chassis heat dissipation structure featuring a thermal module with heat dissipation units and fan units, combined with heat conduction units that transfer heat from the server mainframe's heat generation module to the thermal module, allowing for enhanced heat dissipation without occupying internal space, and enabling flexible arrangement of heat conduction units parallel or normal to the heat generation module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation structure is disposed on each server mainframe, then the heat dissipation performance is improved, but the volume of the server mainframe increases
Solution Approach 1:
The patent combines the heat dissipation structures of multiple server mainframes into a single shared thermal module located in the chassis. Multiple heat conduction units from different server mainframes converge to a common heat dissipation unit, merging previously separate cooling systems into an integrated solution that reduces overall volume while maintaining heat dissipation effectiveness.
2Temperature
If each server mainframe is equipped with more than one heat dissipation structure, then the heat dissipation performance is improved, but the number of server mainframes supported by the chassis is reduced
Solution Approach 1:
The thermal module serves multiple server mainframes simultaneously, making it a universal heat dissipation solution. The shared heat dissipation unit can handle thermal loads from multiple sources, and the modular design with multiple fan units and heat conduction units allows the same thermal module to support various configurations of server mainframes, increasing chassis capacity.
3Strength
If the volumes of the server mainframes and the heat dissipation structures cannot be minified, then the structural integrity is maintained, but the application efficiency and heat dissipation effect of the internal space of the chassis are poorer
Solution Approach 1:
The patent relocates the heat dissipation structure from the horizontal plane (within each server mainframe) to the vertical dimension (in the chassis below or around the server mainframes). This dimensional shift allows the thermal module to occupy space that would otherwise be unused, improving chassis space utilization without compromising the structural integrity or volume of the server mainframes themselves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the heat dissipation effect within the chassis while minimizing the thermal module's presence in the internal space, increasing the use flexibility and supporting more server mainframes without volume constraints.
Implementation Method 1
The at least one heat conduction unit has at least one first end and a second end. The at least one first end is in contact with the heat generation module of the at least one server mainframe. The second end is in contact with the at least one heat dissipation unit of the thermal module. The at least one heat conduction unit serves to conduct the heat of the heat generation module to the at least one heat dissipation unit.
Implementation Method 2
The fan units serve to carry away the heat of the at least one heat dissipation unit to dissipate the heat.
Data Source
AI summary
A chassis heat dissipation structure includes a chassis main body. The chassis main body has a chassis support, a thermal module and at least one heat conduction unit. At least one server mainframe is disposed on the chassis support. The thermal module has at least one heat dissipation unit and multiple fan units. The heat dissipation unit is disposed between the fan units and the server mainframe. The heat conduction unit has at least one first end and a second end. The first end is in contact with a heat generation module of the server mainframe. The second end is in contact with the heat dissipation unit. The heat conduction unit serves to conduct the heat of the heat generation module to the heat dissipation unit. The fan units serve to carry away the heat of the heat dissipation unit to dissipate the heat.