Liquid-Cooled Server Chassis with Parallel Cooling Paths
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Solution Overview
Problem
Existing liquid cooling units for electronic components are complex, inefficient in heat transfer, and difficult to reassemble for simultaneous cooling of multiple components, especially in high-density equipment rack-mounted assemblies.
Innovation Solution
A liquid cooled server chassis design featuring a chassis with integrated liquid plate heat exchangers, liquid row heat sinks, and manifolds that facilitate even distribution of cooling power to multiple components, using a simplified structure with straight tubing and barbed fittings for efficient heat transfer and airflow optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing liquid cooling units are used to cool multiple electronic components, then cooling coverage is improved, but structure complexity increases and heat transfer efficiency decreases
Solution Approach 1:
The liquid cooling system is divided into modular liquid plate heat exchangers, each designed to cool specific electronic components. These modular units can be independently configured and assembled, allowing the system to adapt to different component layouts without requiring a completely complex custom design for each application.
Solution Approach 2:
The liquid plate heat exchangers are designed with universal mounting interfaces and standardized fluid connections that can accommodate various electronic component types and configurations. This universality allows the same basic cooling technology to serve multiple cooling scenarios, reducing overall system complexity while maintaining versatility.
2Adaptability or versatility
If existing liquid cooling units are used to cool multiple electronic components, then cooling coverage is improved, but heat transfer efficiency decreases
Solution Approach 1:
Each liquid plate heat exchanger is specifically designed with local thermal optimization for its target electronic component, with coolant flow paths and contact surfaces tailored to the specific heat generation patterns of different components. This localized optimization ensures high heat transfer efficiency for each component while the modular architecture maintains overall system versatility.
3Temperature
If liquid cooling unit structures are made more complex to evenly distribute cooling power to multiple heat sinks, then cooling uniformity is improved, but device complexity increases
Solution Approach 1:
Multiple liquid plate heat exchangers are merged into a unified cooling system through a common coolant distribution manifold that evenly distributes cooling fluid to all heat exchangers. This merging approach achieves uniform cooling across multiple components while avoiding the need for complex individual control systems for each heat sink.
Solution Approach 2:
A coolant distribution manifold serves as an intermediary component that balances coolant flow distribution to multiple liquid plate heat exchangers. This intermediary device simplifies the overall system architecture by providing centralized flow management rather than requiring complex individual routing for each heat sink.
4Adaptability or versatility
If liquid cooling units are designed with complex structures to cool multiple components, then cooling capability is improved, but ease of assembly and reassembly decreases
Solution Approach 1:
The liquid cooling system is segmented into independent, pre-assembled liquid plate heat exchanger modules that can be manufactured separately and then easily assembled together. This segmentation allows each module to be optimized and tested independently, simplifying the overall assembly process while maintaining comprehensive cooling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by evenly distributing cooling power across multiple components, reducing complexity and improving airflow management, thus maintaining component reliability and performance.
Implementation Method 1
The at least one liquid plate heat exchanger is thermally coupled to the at least one heat generating component and the at least one liquid plate heat exchanger is in fluid communication with the inlet chassis manifold and outlet chassis manifold, respectively, whereby the at least one liquid plate heat exchanger transports heat away from the at least one heat generating component
Implementation Method 2
The liquid cooling unit is configured to be flow through by a cooling fluid... As the fluid circulates in the heat sink, thermal energy is exchanged between the heat sink and the fluid
Implementation Method 3
The liquid row heat sink is in fluid communication with the inlet chassis manifold and outlet chassis manifold, respectfully, wherein the liquid row heat sink is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink
Data Source
AI summary
A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.