Server Chassis Cable Threading Layout for PCIe Module Cooling
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Solution Overview
Problem
Existing I/O-type servers face challenges with high human power requirements for threading operations and inadequate heat dissipation of PCIE modules at the rear end due to the 'front-and-rear row' layout, which also limits compatibility with active heat dissipation modules.
Innovation Solution
A chassis architecture is designed with a PCIE module layer, threading layer, and computing layer, featuring aligned PCIE modules, tool-free assembly components, and a closed cavity for efficient heat dissipation, allowing single-person threading operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a 'front-and-rear row' layout is used to arrange PCIE modules, then the structural compactness is improved, but the heat dissipation performance of rear-end PCIE modules deteriorates
Solution Approach 1:
The patent divides the PCIE module arrangement into two independent rows (front row and rear row) with separate air cooling channels for each row. This segmentation allows each row to have dedicated cooling airflow, solving the heat dissipation problem of rear-end modules while maintaining compact structural arrangement.
2Volume of moving object
If PCIE modules are arranged in a 'front-and-rear row' layout, then the space utilization is improved, but the compatibility with active heat dissipation modules deteriorates
Solution Approach 1:
The patent creates independent air cooling channels for front and rear rows, allowing active heat dissipation modules to be installed in either row without interfering with each other's cooling airflow, thus improving compatibility while maintaining space utilization.
Solution Approach 2:
The patent provides different cooling solutions for different locations: front row modules can use passive cooling or active cooling, while rear row modules are equipped with dedicated cooling channels. This localized quality adjustment ensures compatibility with various heat dissipation types while optimizing space use.
3Stability of the object's composition
If a 'front-and-rear row' layout is used, then the structural integration is improved, but the threading operation difficulty increases
Solution Approach 1:
The patent introduces a riser card as an intermediary component between the PCIE modules and the motherboard. The riser card simplifies the threading operation by providing a standardized interface and cable management structure, reducing the complexity of direct connections while maintaining structural integration.
4Reliability
If multiple persons are required for threading operations, then the operational safety is improved, but the operational efficiency deteriorates
Solution Approach 1:
The riser card serves as a mediator that simplifies the threading process to a程度 where single-person operation becomes feasible. It provides standardized connection interfaces and cable routing structures that reduce the complexity and physical effort required, thereby improving operational efficiency while maintaining safety through proper design.
Solution Approach 2:
The patent designs the threading structure with self-aligning features and standardized interfaces that guide the installation process, reducing the need for multiple persons to coordinate complex manual operations. The structure itself facilitates the threading process, enabling more efficient single-person operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manpower needs and ensures effective heat dissipation for both passive and active PCIE modules, enhancing operational efficiency and compatibility with various heat dissipation methods.
Implementation Method 1
a closed cavity is not formed at a position where the PCIE modules are installed, and therefore this layout may not be compatible with the active heat dissipation PCIE module
Data Source
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Figure 7~8
AI summary
A chassis architecture and a server comprising same. The chassis architecture includes: a PCIE module layer (1), a threading layer (2) and a computing layer (3). The threading layer (2) is provided with a plurality of first threading holes (21), allowing a passage of PCIE cables connected to PCIE modules (7); the upper surface of the threading layer (2) is configured for bearing the PCIE cables; the computing layer (3) is provided with a plurality of second threading holes (33), allowing a passage of the PCIE cables. The threading layer (2) is added to bear the PCIE cables connected to the PCIE modules (7), so that in an installing process, a threading operation may be completed by fixing the PCIE cables to the threading layer (2), then arranging the computing layer (3) and extending the PCIE cables to a mainboard installing area (31) and/or a power supply installing area (32) on the computing layer (3) by one person, thereby reducing manpower requirements and facilitating the operation. Moreover, an upper surface of the threading layer (2) is configured for bearing the PCIE cables, so that a plurality of PCIE modules (7) may be arranged in one row, and thus each of the plurality of PCIE modules (7) may meet the heat dissipation requirement thereof.