Multi-Node Server Connector Layout for Improved Airflow

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Solution Overview

Problem

Multi-node servers face challenges with heat dissipation due to obstructions caused by components such as hard disk backplanes and system backplanes, which hinder air circulation and reduce the server's cooling efficiency.

Innovation Solution

The implementation of first and second connectors with reduced volume, replacing the system backplane, allows for better air circulation by connecting nodes and power supply modules without external power supply modules, and optimizing the arrangement of hard disk backplanes parallel to air flow directions, along with layered PCB structures and spaced copper bars to enhance ventilation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If hard disk backplane and system backplane are arranged perpendicular to air inlet, then component connection reliability is improved, but air circulation is hindered and heat dissipation capability deteriorates

Engineering Contradiction:
Improvecomponent connection reliabilityVSAvoidheat dissipation capability
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The system backplane is eliminated and replaced with distributed connectors on each node. This segmentation allows air to flow through the spaces between connectors rather than being blocked by a large perpendicular backplane structure, thus maintaining connection reliability while improving heat dissipation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connectors are arranged in a distributed pattern across multiple dimensions rather than concentrated on a single perpendicular plane. This dimensional distribution creates pathways for air circulation while maintaining all necessary electrical connections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If external power supply module is used, then power supply capability is improved, but volume occupied increases and air circulation is obstructed

Engineering Contradiction:
Improvepower supply capabilityVSAvoidvolume occupied by power supply module
Core Design Contradiction:
PowerVSVolume of moving object

Solution Approach 1:

The power supply module is merged with each individual node rather than being a separate external component. This integration eliminates the need for a dedicated external power supply volume while maintaining full power supply capability through the distributed connector architecture.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The power supply functionality is nested within each node structure. Each node contains its own power supply capabilities integrated into its design, allowing the system to function without additional external power supply volume.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If multiple nodes are deployed on intensive server, then operational capability is improved, but power consumption increases and heat dissipation becomes more difficult

Engineering Contradiction:
Improveoperational capabilityVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by stationary object

Solution Approach 1:

The server is segmented into multiple independent nodes, each with its own power supply module. This segmentation allows each node to be optimized for efficiency while maintaining high overall operational capability through parallel operation of multiple nodes.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP4206862B1Multi-node server, cabinet server and blade server
Publication Date: 2025.11.05 HUAWEI TECH CO LTD
  • EP4206862B1 patent drawingFigure 1A~1B
  • EP4206862B1 patent drawingFigure 1C~2A
  • EP4206862B1 patent drawingFigure 2B~3A

AI summary

A multi-node server, a cabinet server, and a blade server are provided. In this application, the multi-node server includes a plurality of nodes and a hard disk backplane. Each node includes a power supply module. The power supply module is built in the node. The hard disk backplane is connected to the plurality of nodes through a first connector. The power supply module of each node is connected to a power supply interface of another node through a second connector, where the first connector and the second connector are spaced apart, and air flowing from an air inlet of the multi-node server circulates through a spacing between the first connector and the second connector. A system backplane for connection is not arranged in the multi-node server, but is replaced with the first connector and the second connector with a relatively small volume, so that air in the multi-node server can better circulate while ensuring reliability of the multi-node server, thereby increasing a ventilation volume of the multi-node server and improving a heat dissipation capability of the multi-node server.