High-Density Server Connectors Using Electrode Combinations
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Solution Overview
Problem
Existing high-density servers face challenges in accommodating multiple modules without increasing the amount of empty space, as they require separate slots for different types of modules, leading to inefficiencies in space utilization and future extensibility.
Innovation Solution
A computer design featuring a substrate with connectors that allow multiple modules to be detachably attached via different electrode combinations, enabling efficient use of space by sharing electrodes and forming desired transmission lines for each module's function, while a control method detects and communicates between modules using specific electrode combinations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate slots are prepared for each type of module to ensure future extensibility, then adaptability is improved, but the amount of empty space increases
Solution Approach 1:
The connector is designed with multiple electrode combinations that can accommodate different module types (high-speed communication modules, low-speed communication modules, storage modules, I/O modules) using the same physical slot. Each module type utilizes a specific combination of electrodes, allowing a single connector to serve multiple functions and reduce the need for separate dedicated slots for each module type.
2Ease of manufacture
If the same type of modules with the same electrode layout are installed in the same slot, then manufacturing simplicity is improved, but device complexity increases due to multiple empty slots
Solution Approach 1:
Different combinations of electrodes within the same connector are assigned to different module types based on their specific requirements. High-speed communication modules use certain electrode combinations, while low-speed communication modules, storage modules, and I/O modules use other combinations. This allows standardized connectors to support diverse module types with locally optimized electrode assignments.
Data Source
AI summary
A computer, serving as a high-density server, includes a substrate, a plurality of connectors each including a plurality of electrodes, and a plurality of modules detachably attached to the substrate via connectors. The modules are attached to the connectors via different combinations of electrodes such that a first module (e.g. a CPU) is attached to one connector via a first combination of electrodes while a second module (e.g. a storage module or an attachment module) is attached to another connector via a second combination of electrodes. The connectors are aligned in a first direction on the substrate or in an array defined by first and second directions perpendicular to each other, wherein the connectors are selectively and electrically connected together with electrodes.