Server Enclosure Cooling with Coupled Heat Exchangers

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Solution Overview

Problem

Existing cooling systems for rack-mounted servers, particularly in base station installations, are inefficient and require external cooling systems, leading to inefficiencies and reduced component lifespan due to uneven heat distribution and power constraints.

Innovation Solution

A self-contained cooling fluid circuit within each server enclosure, with thermally coupled heat exchangers between adjacent enclosures, allows heat to flow from hotter to cooler servers, enhancing cooling efficiency without external systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a central cooling system is used for multiple server enclosures, then cooling efficiency is improved in large data centres, but device complexity and space requirements increase for base station installations

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcooling system complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent divides the cooling system into independent segments, where each server enclosure has its own self-contained cooling fluid circuit. This segmentation allows each unit to operate independently with its own heat exchanger, eliminating the need for complex central cooling infrastructure while maintaining effective cooling through thermal coupling between adjacent enclosures.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each server enclosure serves its own cooling needs through integrated heat exchangers that thermally couple with adjacent enclosures. The system uses the heat capacity of neighboring servers to absorb excess heat, creating a self-regulating cooling mechanism that reduces dependency on external cooling systems and minimizes overall system complexity.

Inventive Principle:

Principle #25Self-service

2Area of stationary object

If servers operate in close proximity in enclosed spaces, then space utilization is improved, but heat accumulation increases leading to reduced component lifespan

Engineering Contradiction:

Improvespace utilizationVSAvoidcomponent lifespan

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The patent merges the thermal management functions of adjacent server enclosures by thermally coupling their heat exchangers together. This allows heat to be redistributed across multiple units, where servers experiencing lower thermal loads help cool servers with higher loads, thereby managing heat accumulation in densely packed configurations without compromising component reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The system dynamically changes thermal parameters by allowing heat flow directions and magnitudes to vary based on the thermal state of each server. When one server is hotter than its neighbor, heat flows from the hotter to the cooler server, automatically adjusting to maintain optimal operating temperatures and extend component lifespan in compact installations.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If external cooling systems are deployed at base stations, then cooling capacity is increased, but electrical requirements and space requirements increase

Engineering Contradiction:

Improvecooling capacityVSAvoidelectrical requirements

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent introduces heat exchangers as intermediary components that enable thermal coupling between adjacent server enclosures. These heat exchangers facilitate heat transfer without requiring direct fluid connection or external cooling infrastructure, allowing servers to share cooling capacity through thermal conduction while minimizing electrical and spatial requirements.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves server performance and longevity by balancing heat distribution, reducing the need for external cooling and minimizing electrical and space requirements.

Implementation Method 1

A heat exchanger is thermally coupled to the internal cooling fluid circuit. The heat exchanger may be formed from the housing of the enclosure or may be a separate component.

Methodology Applied

Scientific EffectHeat exchanger: Heat Exchanger

Implementation Method 2

When two such server enclosures are coupled together or in close proximity (e.g., on separate shelves of a rack), the heat exchanger portion or component of one server enclosure is thermally coupled to a neighbouring server enclosure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

heat may flow from whichever of the neighbouring server enclosure is hotter than the other (i.e., in accordance with the second law of thermodynamics)

Methodology Applied

Scientific EffectHeat flow: Conduction (thermal)

Data Source

PatentUS20260101482A1Efficient Server Cooling

Publication Date: 2026.04.09 VODAFONE GROUP SERVICES LTD

AI summary

A server enclosure includes a housing having an interior portion configured to receive one or more server components, a fluid circulator configured to thermally couple to the one or more server components, and a first heat exchanger thermally coupled to the fluid circulator and configured to be thermally coupled to a second heat exchanger of a second server enclosure.