Server Enclosure Cooling Circuit With Inter-Enclosure Heat Exchange
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Solution Overview
Problem
Existing cooling systems for rack-mounted servers, particularly in base station installations, are inefficient and require external cooling systems, leading to server degradation and reduced component life spans due to uneven heat distribution and power constraints.
Innovation Solution
A self-contained cooling fluid circuit within each server enclosure, utilizing a heat exchanger to thermally couple with neighboring enclosures, allowing heat to flow from hotter to cooler servers, enhancing cooling efficiency without external systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a central cooling system is used for multiple server enclosures, then cooling efficiency is improved in large data centres, but device complexity and power requirements increase for base station installations
Solution Approach 1:
The patent divides the cooling system into independent modular units, where each server enclosure has its own self-contained cooling circuit with a fluid circulator and heat exchanger. This segmentation eliminates the need for complex central cooling infrastructure while maintaining effective cooling, as each unit operates autonomously to manage its own thermal loads.
Solution Approach 2:
Each server enclosure serves its own cooling needs through integrated thermal management components. The fluid circulator within each enclosure independently circulates coolant through internal channels and heat exchangers, allowing the system to self-regulate temperature without external cooling infrastructure.
2Area of stationary object
If servers are placed in close proximity in rack-mounted configurations, then space utilization is improved, but heat accumulation and cooling challenges worsen
Solution Approach 1:
The patent thermally couples adjacent server enclosures through direct contact between their heat exchanger components. This merging of thermal management systems allows heat to flow from hotter enclosures to cooler ones, creating a distributed heat redistribution network that enables dense rack mounting while preventing excessive heat accumulation in any single unit.
Solution Approach 2:
The heat exchanger components serve as thermal intermediaries between adjacent server enclosures. These intermediaries facilitate heat transfer between neighboring units through their thermally conductive interfaces, enabling passive heat redistribution that balances thermal loads across densely packed rack-mounted servers.
3Temperature
If external cooling systems are implemented for base station servers, then cooling capacity is improved, but power requirements and electrical load increase
Solution Approach 1:
Each server enclosure independently manages its own cooling through integrated fluid circulators and heat exchangers, eliminating the need for power-hungry external cooling equipment. The self-contained thermal management system reduces overall electrical load while maintaining adequate cooling capacity for base station operations.
Solution Approach 2:
The patent converts the harmful effect of heat generation into a beneficial resource by allowing hotter server enclosures to serve as heat sources that thermally couple with and cool adjacent cooler enclosures. This heat redistribution approach eliminates waste heat and reduces the need for additional active cooling power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves cooling efficiency, extends server operation time under high power loads, reduces component degradation, and minimizes space and electrical requirements.
Implementation Method 1
A heat exchanger is thermally coupled to the internal cooling fluid circuit. The heat exchanger may be formed from the housing of the enclosure or may be a separate component.
Implementation Method 2
When two such server enclosures are coupled together or in close proximity (e.g., on separate shelves of a rack), the heat exchanger portion or component of one server enclosure is thermally coupled to a neighbouring server enclosure
Implementation Method 3
heat generated by components of the server under a higher load (e.g., a CPU and/or GPU) may be absorbed or taken away by a server enclosure housing a server under lower or no load
Implementation Method 4
a fluid circulator configured to thermally couple to the one or more server components
Implementation Method 5
heat may flow from whichever of the neighbouring server enclosure is hotter than the other (i.e., in accordance with the second law of thermodynamics)
Data Source
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AI summary
Server enclosure comprising a housing having an interior portion configured to receive one or more server components. A fluid circulator configured to thermally couple to the one or more server components. A first heat exchanger thermally coupled to the fluid circulator and configured to be thermally coupled to a second heat exchanger of a second server enclosure.