Server Liquid Cooling Plate Layout for Lower Pressure Drop
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Solution Overview
Problem
Conventional liquid cooling heat dissipation systems in servers suffer from high pressure drop losses and reduced heat dissipation capability due to long flow paths and the need for additional liquid return channels, which increase volume, weight, and assembly complexity.
Innovation Solution
A heat dissipation apparatus with a flow distribution plate and heat dissipation member that distributes the working medium from a central inlet to both ends of the heat dissipation channel, reducing pressure drop losses and eliminating the need for a liquid return channel, while allowing for a larger effective heat dissipation area and thinner design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional liquid cooling heat dissipation system with a long flow path is used, then the heat dissipation liquid can flow through the skived fin plate, but a large pressure drop loss is caused reducing heat dissipation capability
Solution Approach 1:
The patent divides the flow path into multiple independent flow channels within the heat dissipation member. By segmenting the single long flow path into multiple shorter parallel paths, the pressure drop loss in each channel is reduced while maintaining overall heat dissipation effectiveness. This is achieved through internal flow distribution structures that create multiple flow routes from the inlet to outlet.
Solution Approach 2:
The patent transitions from a one-dimensional linear flow path to a multi-dimensional flow distribution network. By introducing vertical flow channels and horizontal distribution passages, the working medium can flow through multiple dimensions simultaneously, shortening the effective flow path length and reducing pressure drop while increasing heat dissipation surface utilization.
2Productivity
If a liquid return flow channel is disposed in the heat dissipation member, then heat dissipation can be achieved, but the contact plane area between the heat dissipation member and the chip is reduced
Solution Approach 1:
The patent merges the flow distribution function and heat dissipation function into a single integrated heat dissipation member. The flow distribution channels are formed within the same component that contacts the chip, eliminating the need for separate return flow channels. This integration maximizes the contact plane area between the heat dissipation member and the chip while maintaining effective fluid flow paths.
Solution Approach 2:
The heat dissipation member is designed to perform multiple functions simultaneously: it serves as both the heat transfer surface in contact with the chip and the flow distribution network for the working medium. The internal structure of the heat dissipation member incorporates flow channels that distribute the liquid without requiring additional external return channels, thus preserving maximum contact area.
3Productivity
If a conventional liquid cooling system with separate inlet and outlet channels is used, then heat dissipation liquid can flow through, but the volume and weight of the heat sink increase
Solution Approach 1:
The patent combines the inlet channel, outlet channel, and flow distribution passages into a single integrated heat dissipation member. By merging these separate flow path components into one unified structure, the overall volume and weight of the heat sink are reduced while maintaining the necessary flow paths for effective heat dissipation.
Solution Approach 2:
The flow channels are nested within the heat dissipation member itself rather than being separate external components. The inlet and outlet passages are embedded in the internal structure of the heat dissipation member, allowing the working medium to flow through without increasing the external dimensions or weight of the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation capability by shortening the flow path, reducing pressure drop losses, and allowing for a larger effective heat dissipation area, while minimizing volume, weight, and manufacturing costs.
Implementation Method 1
the heat dissipation member and the flow distribution plate form a sealed cavity, the heat dissipation member includes a heat dissipation portion
Implementation Method 2
Heat dissipation liquid enters from the liquid inlet, flows into the skived fin plate from one end of the skived fin plate, flows out of the skived fin plate from the other end of the skived fin plate, takes away heat dissipated by a chip
Data Source
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AI summary
Embodiments of this application provide a heat dissipation apparatus and a server. The heat dissipation apparatus includes: a cover plate, a flow distribution plate, and a heat dissipation member. A first flow inlet and a first flow outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet communicates with the flow inlet cavity, and the first flow outlet communicates with the flow outlet cavity. The heat dissipation member includes a heat dissipation portion, and a heat dissipation flow channel is formed in the heat dissipation portion. A second flow inlet and at least two second flow outlets are provided in the flow distribution plate, the second flow inlet communicates with the flow inlet cavity and the heat dissipation flow channel, and the second flow inlet is located between two ends of the heat dissipation flow channel. Two of the at least two second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and the second flow outlets communicate with the heat dissipation flow channel and the flow outlet cavity. According to the heat dissipation apparatus and the server provided in embodiments of this application, a pass path of a working medium can be shortened, a pressure drop loss of the working medium in the flow channel can be reduced, and a heat dissipation capability of the heat dissipation apparatus can be improved.