Server Cooling via Segmented Air and Liquid Heat Dissipation
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Solution Overview
Problem
Conventional server systems, especially rack-type configurations, face challenges in heat dissipation due to compactly arranged servers generating thermal heat, which can affect their operation if not dissipated efficiently.
Innovation Solution
The server system incorporates a rack with a fan module and a liquid cooling device, where the server is divided into air-cooled and liquid-cooled spaces, with a shielding cover to direct airflow primarily over the first heat source, utilizing the fan module for air-cooled heat dissipation and the liquid cooling device for the second heat source, optimizing airflow and simplifying the cooling system design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple servers are compactly arranged in a rack, then space utilization is improved, but heat dissipation becomes insufficient
Solution Approach 1:
The server system divides the cooling approach into two segments: air cooling for the first heat source and liquid cooling for the second heat source. This segmentation allows each heat source to be cooled by the most appropriate method, resolving the contradiction between compact arrangement and heat dissipation efficiency.
Solution Approach 2:
Different cooling methods are applied to different locations within the server. The first heat source receives air cooling while the second heat source receives liquid cooling, creating local quality differences that optimize heat dissipation for each specific heat-generating component in the compact rack environment.
2Temperature
If a complex cooling system is designed to handle heat from multiple heat sources, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The cooling system is segmented into two independent subsystems: an air cooling subsystem for the first heat source and a liquid cooling subsystem for the second heat source. This segmentation simplifies the overall design by allowing each subsystem to be optimized independently rather than designing one complex system to handle all heat sources.
Solution Approach 2:
Each heat source serves itself with the most appropriate cooling method without requiring a unified complex cooling system. The first heat source self-cools via air circulation while the second heat source self-cools via liquid cooling, reducing the need for complex coordination and control mechanisms.
3Temperature
If airflow is directed uniformly to all heat sources, then cooling coverage is improved, but energy consumption increases
Solution Approach 1:
Different cooling approaches are applied locally to different heat sources based on their specific cooling needs. The first heat source is cooled by air flow while the second heat source is cooled by liquid cooling, ensuring that each heat source receives the most efficient cooling method without wasting energy on unnecessary cooling of other components.
Solution Approach 2:
Instead of applying uniform air cooling to all heat sources (which would be energy-intensive and less efficient), the system applies partial air cooling to the first heat source and partial liquid cooling to the second heat source. This partial application of different cooling methods optimizes energy consumption by matching the cooling intensity and method to the specific thermal characteristics of each heat source.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, reduces energy consumption, and simplifies the cooling system design by directing airflow effectively over the first heat source while using liquid cooling for the second heat source, maintaining better operational temperatures and reducing complexity.
Implementation Method 1
When the fan module is in operation, the outside air is taken into the server by the fan module
Implementation Method 2
The liquid cooling device is thermally connected to the second heat source
Data Source
AI summary
A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover.