Server Cooling via Sliding Cover Liquid Heat Exchanger
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Solution Overview
Problem
The complexity of open liquid cooling systems in servers makes it difficult to arrange and install tubes in narrow spaces, leading to inefficient heat dissipation and potential damage to powerful processors due to inadequate waste heat removal.
Innovation Solution
A server device design that combines air cooling and liquid cooling systems, where liquid cooling heat exchangers are fixed on a sliding cover, preventing tubes from occupying circuit board space and allowing for efficient heat dissipation by routing tubes outside the casing, thus avoiding electrical short circuits and facilitating cable management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an open liquid cooling system is applied in the server, then heat dissipation efficiency is improved, but the arrangement complexity of tubes increases and installation becomes difficult
Solution Approach 1:
The patent moves the liquid cooling heat exchanger from the traditional position on the circuit board to the cover board, utilizing the vertical/z-dimensional space above the circuit board. This dimensional relocation allows tubes to be arranged on the cover board rather than competing for space on the circuit board, thereby reducing arrangement complexity while maintaining heat dissipation efficiency
Solution Approach 2:
The patent divides the cooling system into separate functional modules: air cooling heat exchangers directly coupled with heat sources, and liquid cooling heat exchangers integrated with the cover board. This segmentation allows independent optimization of each cooling path and simplifies the overall tube arrangement by separating liquid cooling components from circuit board space
2Temperature
If tubes are arranged between storage device and central processing unit, then heat dissipation is achieved, but the narrow interior space makes installation difficult
Solution Approach 1:
The patent relocates the liquid cooling heat exchanger to the cover board, utilizing the vertical dimension above the circuit board components. This eliminates the need to route tubes through the narrow horizontal spaces between storage devices and processors, making installation significantly easier while maintaining effective heat removal from the CPU
3Temperature
If tubes occupy spaces on circuit board, then liquid cooling is implemented, but space for electronic components arrangement is reduced
Solution Approach 1:
The patent integrates the liquid cooling heat exchanger with the cover board structure, moving all liquid cooling components to the dimension above the circuit board. This eliminates tube occupancy on the circuit board entirely, preserving maximum space for electronic component arrangement while maintaining effective heat dissipation through the relocated cooling system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency by utilizing both air and liquid cooling methods simultaneously, simplifying the structure for easier implementation and preventing space occupancy on the circuit board, while ensuring safe and effective heat removal from high-performance processors.
Implementation Method 1
The air cooling heat exchanger is fixed on and thermally coupled with the heat source
Implementation Method 2
The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger
Implementation Method 3
The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger
Data Source
AI summary
A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.