Server GPU Backplane Cooling With Segmented Air Channels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Servers face challenges in efficiently dissipating heat generated by intensive computing architectures, which can lead to overheating, affecting system stability and reducing hardware lifespan.
Innovation Solution
A server design with a housing that accommodates a main processor assembly, graphics processing card assembly, and a heat dissipation assembly, featuring separated heat dissipation air channels for the graphics processing card and data transmission chips, facilitated by a heat dissipation assembly in communication with external air, and components like sliding rails and detachable mounting structures for easy maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If intensive computing architectures with large numbers of processors are employed to speed up data processing, then computing performance is improved, but heat generation increases leading to overheating and reduced system stability
Solution Approach 1:
The patent segments the heat dissipation system into multiple independent air channels: a first heat dissipation air channel for the graphics processing card and a second heat dissipation air channel for data transmission chips. This segmentation allows each component to have dedicated heat dissipation pathways, preventing heat accumulation and improving overall system reliability while maintaining high computing performance.
2Productivity
If processors are densely packed to improve computing performance, then productivity increases, but heat dissipation becomes more difficult and may shorten hardware service life
Solution Approach 1:
The patent utilizes three-dimensional spatial arrangement by positioning the heat dissipation assembly adjacent to the graphics processing card assembly and creating separate heat dissipation air channels. This dimensional approach allows efficient heat dissipation even with dense component packing, ensuring hardware longevity while maintaining high computing performance.
3Reliability
If heat dissipation measures are added to prevent overheating, then system stability is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing structural components by integrating the heat dissipation assembly into the server housing and utilizing the backplane structure to support both data transmission chips and facilitate heat dissipation. This merging approach improves system stability without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, ensuring stable operation, preventing hardware damage, and prolonging server lifespan while improving maintainability and service quality.
Implementation Method 1
a heat dissipation assembly provided adjacent to the graphics processing card assembly and in communication with external air, wherein the heat dissipation assembly is configured to dissipate heat from the graphics processing card assembly and the plurality of data transmission chips
Data Source
AI summary
A server includes a housing provided with an accommodating cavity; a main processor assembly, a graphics processing card assembly, and a graphics processing card backplane that are accommodated in the accommodating cavity, wherein a gap is formed between the graphics processing card backplane and a bottom portion of the housing, a first side of the graphics processing card backplane is provided with a plurality of connecting interfaces, the graphics processing card assembly is connected to the plurality of connecting interfaces, a second side of the graphics processing card backplane is provided with a plurality of data transmission chips, and the plurality of data transmission chips are electrically connected to the plurality of connecting interfaces, respectively; and a heat dissipation assembly provided adjacent to the graphics processing card assembly, the heat dissipation assembly being configured to dissipate heat from the graphics processing card assembly and the plurality of data transmission chips.