Server Heat Dissipating Assembly Airflow Redirection
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Solution Overview
Problem
Existing heat dissipation systems in servers are inefficient when the device is not fully loaded with components, as airflow distribution changes, leading to inadequate cooling of the central processing unit while over-cooling memory modules, potentially causing operational failures.
Innovation Solution
A heat dissipating assembly featuring a central processing unit, memory slots, a first cooling fin set, a second cooling fin set, and heat conductive members, where the second cooling fin set is located between the airflow generating device and memory slots to redirect airflow and increase wind resistance, ensuring efficient heat dissipation from the central processing unit to both the cooling fin sets and memory slots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the heat dissipation component is designed for fully-loaded state, then the heat dissipation performance is optimized for maximum component load, but the heat dissipation efficiency deteriorates when the device is not fully loaded due to changed airflow distribution
Solution Approach 1:
The heat dissipation assembly is segmented into multiple independent cooling channels: a first cooling channel for the central processing unit and a second cooling channel for memory modules. This segmentation allows each channel to be optimized for its specific thermal load independently, resolving the contradiction between maximizing heat dissipation for full load and maintaining efficiency for partial load conditions.
Solution Approach 2:
Different cooling strategies are applied to different locations: the first cooling channel provides targeted cooling for the central processing unit with higher airflow, while the second cooling channel provides supplementary cooling for memory modules. This local differentiation ensures optimal heat dissipation performance across various operational states without requiring the entire system to be redesigned.
2Temperature
If airflow is increased to the cooling fin set, then the central processing unit temperature is reduced, but the memory module temperature may increase due to heat transfer
Solution Approach 1:
The cooling system is divided into separate channels: the first cooling channel handles central processing unit cooling independently, while the second cooling channel handles memory module cooling. This prevents heat generated by the central processing unit from being transferred to the memory module, allowing aggressive cooling of the CPU without harming memory temperature.
Solution Approach 2:
The heat dissipation assembly acts as an intermediary thermal management system that intercepts heat from the central processing unit and directs it through dedicated cooling channels, preventing direct heat transfer to the memory module while still maintaining overall system thermal balance.
3Stability of the object's composition
If virtual memory modules are used to maintain flow field, then the wind resistance at memory slots remains constant, but the cost increases and the virtual modules must be removed after additional memory is added
Solution Approach 1:
The invention extracts the flow field stabilization function from the memory slots themselves and relocates it to the second cooling channel. This allows the memory slots to be used for actual memory expansion without requiring virtual placeholders, eliminating the need to remove virtual modules after hardware upgrades.
Solution Approach 2:
The second cooling channel serves multiple functions: it provides cooling for memory modules when real memory is installed, maintains appropriate airflow resistance when memory slots are empty, and eliminates the need for virtual memory modules. This multi-functionality resolves the contradiction between maintaining flow field stability and avoiding system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains the central processing unit within safe temperature limits while keeping memory modules cool, reducing energy consumption and eliminating the need for virtual memory modules, as demonstrated by lower temperatures and reduced airflow and power consumption compared to prior art systems.
Implementation Method 1
A part of heat generated by the central processing unit is transferred to the second cooling fin set via the heat conductive member
Implementation Method 2
The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit
Data Source
AI summary
A server and a heat dissipating assembly thereof includes an airflow generating device, a central processing unit, several memory slots, a first cooling fin set, a second cooling fin set and a heat conductive member. The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit. The several memory slots are used to plug of memories, and they are located at a lateral side of a central processing unit. The first cooling fin set is correspondingly located over the central processing unit and at a lateral side of the memory slots. The second cooling fin set is located at a front side of the memory slots and between the airflow generating device and the memory slots. The first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member.