Server Heat Dissipation via Vertical Liquid Cooling
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Solution Overview
Problem
The complexity of open liquid cooling systems in servers makes it difficult to arrange and install tubes in narrow spaces, leading to inefficient heat dissipation and potential damage to powerful processors due to inadequate waste heat removal.
Innovation Solution
A server device design that combines air cooling and liquid cooling systems, where liquid cooling heat exchangers are fixed on a removable cover, preventing tubes from occupying circuit board space and allowing for efficient heat dissipation by routing tubes outside the casing, thus avoiding interference with electronic components and cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an open liquid cooling system is applied to remove waste heat from powerful processors, then heat dissipation efficiency is improved, but the arrangement of tubes becomes too complex and installation becomes difficult in the narrow interior space of the server
Solution Approach 1:
The patent moves the liquid cooling heat exchanger from the traditional planar arrangement on the circuit board to a three-dimensional space above the circuit board, utilizing the vertical dimension. The heat exchanger is positioned in the space between the circuit board and the server cover, allowing tubes to be routed vertically rather than horizontally across the circuit board, thereby reducing tube complexity and improving installability while maintaining heat dissipation efficiency
Solution Approach 2:
The cooling system is segmented into distinct functional modules: air cooling heat exchangers directly coupled with heat sources (processors), and liquid cooling heat exchangers positioned above the circuit board. This segmentation allows each module to be optimized independently and simplifies the overall tube arrangement by separating the cooling functions spatially
2Temperature
If tubes are arranged on the circuit board to connect liquid cooling heat exchangers, then heat dissipation is achieved, but spaces on the circuit board used to arrange electronic components are occupied
Solution Approach 1:
The liquid cooling heat exchanger is relocated from the two-dimensional circuit board plane to the three-dimensional space above it. This vertical relocation frees up the entire circuit board surface area for electronic components while the heat exchanger operates in the unused vertical space, eliminating the space occupation conflict
Solution Approach 2:
The liquid cooling heat exchanger is positioned in the space between the circuit board and the server cover, effectively nesting the cooling system within the existing server structure. This nesting approach utilizes otherwise wasted space and prevents interference with circuit board component arrangement
3Temperature
If tubes are routed through the narrow interior space of the server, then liquid cooling is implemented, but installation becomes difficult and time-consuming
Solution Approach 1:
The tube routing is changed from horizontal paths through narrow gaps between components to vertical paths through the open space above the circuit board. This dimensional change creates much larger routing channels that are easier to access and install, significantly reducing installation time and difficulty
Solution Approach 2:
The liquid cooling heat exchanger and its tube connections are extracted from the densely packed interior space and positioned in the more accessible area above the circuit board. This extraction simplifies the installation process by providing easier access points for tube routing and connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency by utilizing both air and liquid cooling methods simultaneously, preventing space occupancy on the circuit board and minimizing the risk of electrical short circuits, while simplifying the heat dissipation structure for easier implementation in conventional servers.
Implementation Method 1
The air cooling heat exchanger is fixed on and thermally coupled with the heat source
Implementation Method 2
air cooling heat exchanger
Implementation Method 3
The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger
Data Source
AI summary
A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.