Server Liquid Cooling Layout for High- and Low-Power Devices
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Solution Overview
Problem
Existing server cooling methods, such as cooling plate liquid cooling and single-phase immersion liquid cooling, fail to effectively dissipate heat from both high and low power consumption devices without risking liquid leakage or providing inadequate heat dissipation.
Innovation Solution
A server liquid cooling system with a cooling plate assembly and coolant distribution unit that utilizes a dual-phase cooling method, where high power consumption devices are cooled by a cooling plate liquid cooling mode and low power consumption devices are cooled by single-phase immersion liquid cooling, with an open structure cooling plate assembly to prevent liquid leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling plate liquid cooling is used, then heat dissipation effect on local high power consumption devices is improved, but the system has risk of liquid leakage and cannot cool other devices
Solution Approach 1:
The system divides the cooling function into two independent parts: a cooling plate assembly for high power consumption devices and a liquid cooling cavity for low power consumption devices. This segmentation allows each part to use the most suitable cooling method while preventing liquid leakage risks from affecting the entire system.
Solution Approach 2:
The cooling plate assembly is specifically positioned to contact only the high power consumption device that generates the most heat, providing localized intensive cooling where it is most needed, while other devices use the general liquid cooling cavity.
2Adaptability or versatility
If single-phase immersion liquid cooling is used, then all devices can be cooled, but heat dissipation effect on local high power consumption devices is poor
Solution Approach 1:
The cooling system is segmented into a cooling plate assembly for high power consumption devices and a liquid cooling cavity for other devices, allowing each segment to use the optimal cooling method for its specific requirements.
Solution Approach 2:
The cooling plate assembly provides concentrated cooling capacity specifically at the location of high power consumption devices, while the liquid cooling cavity provides general cooling coverage for other devices with lower heat generation.
3Temperature
If cooling plate assembly is used, then heat dissipation on high power consumption devices is improved, but device complexity increases
Solution Approach 1:
The cooling plate assembly and liquid cooling cavity are merged into a single integrated system where the cooling plate is positioned within the liquid cooling cavity, sharing common structural support and coolant circulation infrastructure.
Solution Approach 2:
The liquid cooling cavity serves dual functions: it provides general cooling for low power consumption devices and also receives coolant from the cooling plate assembly to enhance cooling of high power consumption devices, making the system more efficient without adding proportional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently dissipates heat from both high and low power consumption devices, improving heat dissipation effects while avoiding liquid leakage and pressure resistance issues.
Implementation Method 1
coolant flows into the second liquid cooling cavity through the first liquid inlet hole and the second liquid inlet hole to perform heat exchange with the first high power consumption device
Implementation Method 2
the heat-exchanged coolant flows into the second high power consumption device through the second liquid outlet hole to perform heat exchange with the second high power consumption device
Implementation Method 3
coolant flows into the first liquid cooling cavity through the second liquid outlet hole to perform heat exchange with the low power consumption device
Data Source
AI summary
A server and a server liquid cooling system are provided. The server includes a computer case provided with a first liquid cooling cavity, and a first liquid inlet hole and a first liquid outlet hole that are in communication with the first liquid cooling cavity; a high power consumption device and a low power consumption device that are provided in the first liquid cooling cavity; and a cooling plate assembly provided in the first liquid cooling cavity and corresponding to the high power consumption device. The cooling plate assembly is provided with a second liquid cooling cavity, and a second liquid inlet hole and a second liquid outlet hole that are in communication with the second liquid cooling cavity, the second liquid inlet hole is in communication with the first liquid inlet hole, and the second liquid outlet hole is in communication with the first liquid cooling cavity.