Server Housing Liquid Cooling With Local Flow and Leak Protection

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Solution Overview

Problem

Traditional air cooling systems struggle to manage thermal management risks in high-performance systems due to increased thermal design power, while liquid cooling offers advantages in specific heat and latent heat of vaporization, but poses challenges in direct contact and leakage protection.

Innovation Solution

Implementing a liquid cooling system with dielectric coolant for direct immersion cooling, incorporating local temperature control circuitry and a cooling distribution unit (CDU) to manage temperature and protect electronics from coolant leaks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid cooling system is implemented for direct contact with electronic components, then thermal management efficiency is improved, but risk of coolant leakage and electronic damage increases

Engineering Contradiction:

Improvethermal management efficiencyVSAvoidcoolant leakage risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces dielectric coolant as an intermediary substance that thermally couples with electronic components to transfer heat while simultaneously providing electrical insulation. This mediator enables efficient heat transfer without direct electrical contact, eliminating the hazard of coolant-induced short circuits while maintaining thermal management effectiveness

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates an electrically inert environment by using dielectric coolant that does not conduct electricity. This inert thermal medium allows direct contact cooling of electronic components without introducing electrical hazards, effectively neutralizing the harmful effect of potential coolant leakage on electronic systems

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Device complexity

If traditional air cooling systems are used, then system complexity is reduced, but thermal management capability is insufficient for high-performance systems

Engineering Contradiction:

Improvesystem complexityVSAvoidthermal management capability

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent transitions from air-based convective cooling to liquid-based hydraulic cooling systems. By utilizing liquid coolant with superior specific heat and thermal conductivity properties, the system achieves significantly enhanced thermal management capability for high-performance electronic components while maintaining reasonable system complexity through established liquid cooling architectures

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Reliability

If dielectric coolant is used for direct immersion cooling, then electrical insulation is improved, but cost of coolant and system increases

Engineering Contradiction:

Improveelectrical insulationVSAvoidcoolant cost

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The patent modifies the physical and chemical parameters of the coolant by selecting dielectric fluids with appropriate electrical insulation properties, thermal conductivity, and heat capacity. By optimizing these parameters, the system achieves sufficient electrical protection while using cost-effective dielectric coolants rather than expensive specialized fluids

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal management by effectively cooling electronic components and safeguarding against coolant leaks, improving system reliability and efficiency.

Implementation Method 1

liquid has inherent advantages of higher specific heat (when no boiling is involved) and higher latent heat of vaporization (when boiling is involved)

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

The coolant flow control circuitry controls a flow rate of the coolant to the socket-level component

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

incorporating local temperature control circuitry and a cooling distribution unit (CDU) to manage temperature and protect electronics from coolant leaks

Methodology Applied

Scientific EffectLeakage detection:

Data Source

PatentEP4671921A1Methods and apparatus for localized temperature control and leakage protection in a server housing

Publication Date: 2025.12.31 INTEL CORP

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AI summary

Methods and apparatus for localized temperature control and leakage protection in a server housing are disclosed. An example system includes interface circuitry, machine readable instructions, and at least one programmable circuit of a server disposable inside a portion of a server housing. The at least one programmable circuit are to at least one of instantiate or execute the machine readable instructions to identify a temperature of the server, determine a target temperature for a workload for the server, and control an actuator based on the temperature and the target temperature, the actuator to control a local flow rate of a coolant in the portion of the server housing.