Server Memory Cooling Assembly With Elastic Thermal Contact
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Solution Overview
Problem
Current heat dissipation devices for servers are ineffective in dissipating heat from memory storages efficiently.
Innovation Solution
A heat dissipation device comprising first and second heat-conducting members with elastic deformation capabilities, coupled with liquid cooling members, allows for efficient heat transfer and dissipation by facilitating close contact between memory storages and heat-conducting members through elastic deformation and constraining mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation devices are used, then the structure is simple, but the heat dissipation effectiveness is poor
Solution Approach 1:
The patent employs elastic deformation mechanisms where the heat-conducting member is designed to flexibly adapt to the memory storage module. The elastic component allows the heat-conducting member to dynamically adjust its position and shape to maintain optimal thermal contact with the memory module, transforming a static rigid structure into a dynamic adaptive one that ensures reliable heat dissipation.
Solution Approach 2:
The patent changes the physical state and mechanical properties of the heat-conducting member by introducing elastic deformation capabilities. The member transitions from a rigid fixed position to a flexible state that can deform elastically, allowing it to conform to the memory storage module's surface and maintain consistent thermal contact under varying conditions.
2Reliability
If rigid heat-conducting members are used, then the structure is stable, but the thermal contact with memory storage is insufficient
Solution Approach 1:
The elastic component enables the heat-conducting member to dynamically adjust during installation and operation. During installation, the elastic member can be compressed or deformed to fit into the slot, and once installed, it naturally returns to its original shape to maintain firm thermal contact with the memory storage module, ensuring both easy installation and reliable thermal contact.
Solution Approach 2:
The elastic deformation mechanism enables the heat-conducting member to self-adjust and self-constrain to the memory storage module. The elastic recovery force automatically ensures consistent thermal contact without requiring additional fastening mechanisms or complex installation procedures, making the system self-regulating.
3Reliability
If memory storage modules are firmly constrained, then the thermal contact is improved, but the installation and removal becomes difficult
Solution Approach 1:
The elastic component provides a dynamic constraint mechanism that balances thermal contact quality with ease of operation. During installation, the elastic member can be temporarily deformed to allow easy insertion. Once installed, the elastic recovery force maintains firm thermal contact. For removal, the elastic member can be compressed again to release the constraint, enabling easy removal without damage.
Solution Approach 2:
The elastic deformation capability acts as a cushioning mechanism that prevents damage during installation and removal. The elastic member absorbs the mechanical stress and force applied during module insertion and extraction, protecting both the heat-conducting member and the memory storage module from damage while maintaining operational ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer efficiency and dissipation by reducing thermal resistance and facilitating easy installation and removal of memory storages, thereby improving overall heat management in servers.
Implementation Method 1
A heat dissipation device is provided to dissipate heat from memory storages of server
Implementation Method 2
facilitating close contact between memory storages and heat-conducting members through elastic deformation
Implementation Method 3
coupled with liquid cooling members, allows for efficient heat transfer and dissipation
Data Source
AI summary
A heat dissipation device is provided for a server. The heat dissipation device comprises a plurality of first heat-conducting members, a plurality of second heat-conducting members and two liquid cooling members. Each of the plurality of second heat-conducting members is elastic deformable along the first direction, so that each of the slots squeezes a corresponding memory storage and the plurality of second heat-conducting members is closely in contact with the corresponding memory storage.