Server Module Heat Dissipating Device with Multi-Directional Fins
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Solution Overview
Problem
The heat dissipation efficiency of servers is inadequate, leading to heat accumulation and performance degradation. Existing server designs struggle to effectively dissipate heat generated by processors.
Innovation Solution
A server module with a heat dissipating device comprising multiple fin assemblies and a thermal conductive member, optimized to enhance airflow resistance and balance airflow pressure, thereby improving heat dissipation efficiency. The third fin assembly is strategically positioned to optimize airflow and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation designs are used, then device complexity is low, but heat dissipation efficiency is poor leading to heat accumulation
Solution Approach 1:
The heat dissipation device is divided into multiple independent fin assemblies (first, second, and third fin assemblies) arranged in different spatial directions. Each fin assembly acts as an independent heat dissipation unit, allowing optimized heat transfer pathways and improving overall heat dissipation efficiency without excessive complexity increase.
Solution Approach 2:
The patent introduces a third fin assembly extending in a direction different from the first and second fin assemblies, transforming a planar two-dimensional heat dissipation structure into a three-dimensional multi-directional structure. This spatial expansion increases heat dissipation surface area and improves thermal management efficiency.
2Temperature
If heat dissipation structure is increased to improve heat dissipation efficiency, then temperature control improves, but device complexity increases
Solution Approach 1:
Multiple fin assemblies are merged with a common support structure and thermal conduction path, integrating several heat dissipation functions into a unified device. This consolidation achieves effective multi-directional heat dissipation while avoiding the complexity of completely separate heat dissipation systems.
Solution Approach 2:
Different fin assemblies are positioned to address specific local heat generation areas on the processor, with each fin assembly optimized for its particular thermal zone. This localized approach improves temperature control efficiency without requiring a uniformly complex structure throughout the entire device.
3Temperature
If airflow resistance is increased to enhance heat dissipation, then heat dissipation efficiency improves, but power consumption increases
Solution Approach 1:
The heat dissipation device utilizes natural convection currents created by the multi-directional fin structure, allowing airflow patterns to dynamically adapt to thermal gradients without requiring high-speed forced airflow. This reduces the energy needed to drive air movement while maintaining effective heat dissipation.
Solution Approach 2:
The fin assembly structure is designed to generate its own airflow through natural buoyancy-driven convection, where heated air naturally rises through and around the fins without external power input. This self-servicing mechanism reduces dependency on high-power cooling fans while maintaining heat dissipation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces processor temperature by 4 degrees Celsius, improves heat dissipation efficiency, and decreases power consumption by optimizing airflow resistance and balancing airflow pressure.
Implementation Method 1
The heat dissipating device (30) connects to the processor (20). At least a portion of the heat generated by the processor (20) can be transferred to the heat dissipating device (30)
Implementation Method 2
dissipated by the heat dissipating device (30)... increase an airflow volume on the second fin assembly (32)... optimizing airflow resistance and balancing airflow pressure
Data Source
AI summary
A server module includes a housing, a processor, and a dissipating device. The processor and the dissipating device are disposed in the housing. The dissipating device includes a first fin assembly, a second fin assembly, a third fin assembly, and a substrate. The first fin assembly connects to the processor. The first fin assembly and the second fin assembly are disposed along a first direction. The second fin assembly and the third fin assembly are disposed along a second direction. The thermal conductive member connects the first fin assembly and the second fin assembly. The substrate is disposed between and connected to the second fin assembly and third fin assembly. The second fin assembly, the substrate, and third fin assembly are disposed along the second direction. The present disclosure further provides a server including the server module.