Cross-Board Signal Interconnection Layout for Multi-Processor Server Nodes

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Solution Overview

Problem

Traditional multi-processor server node cross-board signal interconnection solutions require large vertical middle backboards, leading to increased heat dissipation issues and signal loss due to multiple high-speed connectors, which hinder rapid disassembly and maintenance.

Innovation Solution

A multi-processor server node cross-board signal interconnection device with first and second signal connectors arranged on the surface and back of a middle backboard, respectively, connected by signal interconnection cables, optimizing space usage and reducing signal transfer levels and losses by eliminating inter-board signal connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional high-speed connectors are used for cross-board signal interconnection, then signal connection is achieved, but mounting space occupation increases and signal loss increases due to multiple transfer levels

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidmounting space occupation
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from horizontal signal routing on the board surface to vertical signal routing through the board thickness. High-speed connectors are arranged vertically on the middle backboard, allowing signals to pass through the board rather than traveling along its surface. This dimensional change reduces the horizontal space occupation while maintaining signal connection reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple high-speed connectors are arranged on the middle backboard, then signal interconnection is achieved, but heat dissipation space is reduced and system stability deteriorates

Engineering Contradiction:
Improvesignal interconnection capabilityVSAvoidheat dissipation performance
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

By arranging connectors vertically through the board rather than horizontally on the surface, the patent frees up horizontal space that can be used for heat dissipation air ducts and thermal management features. The vertical arrangement allows signals to pass through the board thickness, reducing the horizontal footprint of connector arrangements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If traditional horizontal board arrangement with vertical middle backboard is used, then signal interconnection is achieved, but signal transfer levels increase and signal loss increases

Engineering Contradiction:
Improvesignal interconnectionVSAvoidsignal loss
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The patent extracts the signal transmission path from the traditional multi-level board routing and consolidates it into a direct vertical path through the middle backboard. By removing intermediate horizontal routing segments and using vertical connectors that pass through the board, the signal transfer path is shortened and simplified, reducing signal loss.

Inventive Principle:
Principle #2Taking out (Extraction)

4Reliability

If cables are used for signal interconnection, then signal loss is reduced, but cable arrangement complexity increases and layout flexibility is reduced

Engineering Contradiction:
Improvesignal transmission rateVSAvoidcable arrangement complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the cable function directly into the middle backboard structure by integrating high-speed connectors and signal routing paths within the board itself. This consolidation eliminates the need for separate external cables, reducing arrangement complexity while maintaining the low signal loss benefits of direct cable-like connections.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240072465A1Multi-Processor Server Node Cross-Board Signal Interconnection Device
Publication Date: 2024.02.29 SHANDONG YINGXIN COMP TECH CO LTD
  • US20240072465A1 patent drawing
  • US20240072465A1 patent drawing
  • US20240072465A1 patent drawing

AI summary

Disclosed is a multi-processor server node cross-board signal interconnection device. The device includes a middle backboard, a plurality of first signal connectors arranged on a surface of the middle backboard, a plurality of second signal connectors arranged on a back surface of the middle backboard and having the same distribution region as all the first signal connectors, a plurality of signal leading-out terminals arranged on all node single boards and configured to be connected to all the second signal connectors, and a plurality of signal interconnection cables connected between the second signal connectors. In this way, all the second signal connectors transmit signals on the middle backboard by means of the signal interconnection cables. All the second signal connectors and the first signal connectors are arranged in the same region, such that a risk of signal interference is eliminated.