Server Power Supply PCB Stacking for Heat Dissipation
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Solution Overview
Problem
The increasing power consumption of server power supplies results in poor heat dissipation performance due to high power density and limited space for functional components.
Innovation Solution
The implementation of an expansion board within the power supply, which increases wiring layout space and utilizes unused space above the plug-in portion, reducing power density and improving heat dissipation by redistributing functional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power consumption of server power supplies is increased to meet the power requirements of high-performance CPUs and components, then the power supply capacity is improved, but the heat dissipation performance deteriorates due to high power density
Solution Approach 1:
The patent introduces a third-dimensional layout by placing the expansion board vertically above the first circuit board, utilizing the Z-axis space within the power supply housing. This vertical stacking arrangement increases the effective volume for component placement without expanding the horizontal footprint, thereby reducing power density and improving heat dissipation while maintaining or increasing power supply capacity
2Volume of stationary object
If the space above the first plug-in portion is left unused in traditional layouts, then the structural simplicity is maintained, but the usable space within the power supply is reduced, limiting component arrangement flexibility
Solution Approach 1:
The expansion board is nested vertically above the first circuit board, utilizing the unused vertical space above the first plug-in portion. This nesting arrangement effectively doubles the usable space for component placement without increasing the external dimensions of the power supply, while the electrical connection between boards maintains structural integration
3Ease of manufacture
If all functional components are disposed on a single first circuit board, then the device structure is simplified, but the wiring layout space is insufficient, making component arrangement difficult and heat dissipation poor
Solution Approach 1:
The patent segments the functional components into two groups: first functional components on the first circuit board and second functional components on the expansion board. This segmentation distributes the component density, provides adequate wiring layout space on each board, and facilitates heat dissipation by separating heat-generating components across different physical locations while maintaining electrical connectivity
Data Source
AI summary
A power supply including a first circuit board, an expansion board, and a plurality of functional components is provided. The first circuit board includes a main body and a first plug-in tab projecting from an end of the main body. The first plug-in tab is electrically connected to an external second circuit board and the expansion board is disposed on the main body and electrically connected to the main body. A projection of the expansion board overlaps at least a portion of the first plug-in tab. The plurality of functional components include a first functional component and a second functional component, the first functional component is disposed on the main body and electrically connected to the main body, and the second functional component is disposed on the expansion board and electrically connected to the expansion board.