Server Processing Assembly Partitioning for High-Density GPU Placement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
To enhance the processing speed of data in servers providing real-time cloud services, existing processing assemblies require more processing units, which poses a challenge in accommodating them within limited space effectively.
Innovation Solution
A processing assembly design that includes a cage with a partition dividing it into two accommodation spaces, each housing a sub-cage with a motherboard, switch boards, and bridge boards, allowing for the efficient placement and connection of multiple processing units, including GPUs, to increase processing capacity within a confined area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more processing units are disposed in the processing assembly to increase processing speed, then the processing capacity is improved, but the device complexity and space utilization become problematic
Solution Approach 1:
The processing assembly is divided into a first sub-assembly and a second sub-assembly, each containing its own motherboard with processing units. This segmentation allows independent configuration and optimization of each sub-assembly, reducing overall complexity while maintaining high processing capacity through parallel operation of multiple processing units.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by disposing the two sub- Assemblies in different spatial regions within the housing, with motherboards positioned at different heights and angles. This dimensional arrangement maximizes space utilization and accommodates more processing units without increasing the footprint of the assembly.
2Quantity of substance
If more processing units are accommodated in limited space, then processing capacity increases, but the arrangement complexity and connection complexity increase
Solution Approach 1:
Switch boards are introduced as intermediary components that facilitate electrical connections between processing units on the motherboards and external devices or other processing units. This intermediary structure simplifies the connection architecture by providing a centralized routing point, reducing the complexity of direct point-to-point connections between multiple processing units.
Solution Approach 2:
The motherboards are designed with multiple processing units and switch boards that can serve multiple functions simultaneously - processing data, routing signals, and providing I/O interfaces. This multi-functionality reduces the need for separate dedicated components, thereby reducing overall connection complexity while accommodating more processing units.
Data Source
AI summary
A processing assembly including cage, partition, two sub-cages, two motherboards, two switch boards and at least one bridge board. Partition is disposed in cage so as to divide inner space of cage into first accommodation space and second accommodation space. Two sub-cages are respectively disposed in first accommodation space and second accommodation space. Two motherboards are respectively disposed on two sub-cages. Two motherboards each include a plate and a plurality of processing units disposed on the plate. Two switch boards are respectively disposed on two sub-cages and respectively electrically connected to two motherboards. Bridge board is electrically connected to two motherboards. One of two motherboards is located between one of two switch boards and bridge board, and another one of two motherboards is located between another one of two switch boards and bridge board.