Server Rack Coolant Manifold Layout for High-Density Heat Dissipation

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Solution Overview

Problem

Conventional heat dissipation solutions in server racks occupy valuable space, compromising computational hardware density and are inefficient in managing heat within confined spaces, often requiring multiple cooling structures across multiple rack units.

Innovation Solution

A server rack design incorporating coolant distribution manifolds at opposing front edges to facilitate coolant flow, with separate inlets and outlets for efficient heat transfer, utilizing a coolant distribution unit (CDU) to circulate liquid coolant for effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional coolant systems are installed in server racks, then heat dissipation is achieved, but valuable space is occupied compromising computational hardware density

Engineering Contradiction:
Improveheat dissipationVSAvoidcomputational hardware density
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The patent routes coolant manifolds through the vertical edge portions of the rack structure rather than installing cooling components within the horizontal rack units. This dimensional shift allows coolant distribution to occur in the vertical dimension, preserving horizontal space for computational hardware while achieving effective heat dissipation through front and rear edge manifolds that serve multiple rack units simultaneously.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If conventional coolant systems are installed to dissipate heat, then cooling capacity is provided, but multiple rack units are required increasing device complexity

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidcooling structure configuration
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The edge-mounted coolant manifolds serve multiple rack units simultaneously, with a single manifold structure providing cooling capacity across several vertical rack units. The front edge manifold distributes coolant to multiple units through vertical routing, and the rear edge manifold collects heated coolant from multiple units, eliminating the need for separate cooling structures in each rack unit and reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Volume of moving object

If coolant manifolds are routed through edge portions, then space utilization is optimized, but routing complexity increases

Engineering Contradiction:
Improvespace utilizationVSAvoidcoolant routing configuration
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent combines the coolant distribution and collection functions into integrated manifold structures mounted on the rack's edge portions. The front edge manifold merges multiple coolant distribution lines into a single vertical routing path, and the rear edge manifold merges multiple coolant collection lines similarly. This consolidation reduces the number of separate routing paths needed compared to individual unit cooling, simplifying the overall routing configuration while maximizing space utilization.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation efficiency while optimizing space utilization, allowing for higher computational hardware density without the need for multiple cooling structures, thus improving performance and reliability of server systems.

Implementation Method 1

a coolant distribution unit (CDU), which is configured to circulate liquid for transferring heat generated by the server system to the liquid

Methodology Applied
Scientific EffectHeat transfer: Convection

Implementation Method 2

the first coolant distribution manifold includes a plurality of outlets that is configured to provide coolant flows to the one or more rack servers from the first front edge of the rack structure

Methodology Applied
Scientific EffectHeat absorption: Convection

Data Source

PatentUS20260068088A1Methods, Devices, and Systems for Dissipating Heat at a Server System
Publication Date: 2026.03.05 SUPER MICRO COMPUTER INC(US)
  • US20260068088A1 patent drawing
  • US20260068088A1 patent drawing
  • US20260068088A1 patent drawing

AI summary

This application is directed to heat dissipation for a server system. A server rack includes a rack structure including a plurality of slots for receiving at least one or more rack servers. The server rack includes a first coolant distribution manifold coupled to a first front edge of the rack structure that extends adjacent to the plurality of slots. The first coolant distribution manifold includes a plurality of outlets configured to provide coolant flows to the one or more rack servers from the first front edge of the rack structure. The server rack further includes a second coolant distribution manifold coupled to a second front edge of the rack structure that extends adjacent to the plurality of slots. The second coolant distribution manifold includes a plurality of inlets configured to collect, from the second front edge of the rack structure, the coolant flows exiting the one or more rack servers.