Server Thermal Management via Logical Device Shuffling

The patent segments the data storage devices into multiple groups and distributes them across different locations within the server chassis. By dividing the concentrated storage devices into scattered positions, the system eliminates large continuous hot zones while maintaining high storage density. This spatial segmentation allows air channels to effectively reach multiple dispersed heat sources, improving overall heat transfer efficiency.

The patent implements local quality by creating a distributed arrangement where storage devices are strategically positioned in different regions of the chassis. Each local area has optimized air channel access, and thermal management actions are applied locally to specific device groups based on their thermal conditions. This ensures that heat dissipation is optimized at each local level while maintaining global storage capacity.

The patent divides the concentrated group of storage devices into multiple sub-groups distributed across different chassis regions. This segmentation maintains high space utilization by keeping devices densely packed overall, while preventing the formation of large continuous hot zones that would compromise thermal management performance.

The patent transitions from a two-dimensional concentration of devices in a single region to a three-dimensional distributed arrangement across multiple regions. By utilizing spatial distribution across the chassis volume rather than concentrating devices in a planar area, the system achieves both efficient space utilization and effective thermal management through multi-dimensional space usage.

The patent segments the heat dissipation pathway by distributing thermal sources across multiple locations, allowing air channels to serve multiple dispersed devices rather than requiring large channels to service a concentrated group. This segmentation enables smaller, more efficient air channels to effectively deliver cooling air to each local device cluster while maintaining high overall device density.

The patent introduces thermal management actions as intermediaries between the heat-generating devices and the air cooling system. By implementing active thermal management through device redistribution and localized cooling strategies, the system compensates for the reduced size of air channels, maintaining effective heat dissipation despite smaller channel dimensions and higher device density.