Server Three-Space Layout for High-Density Cooling
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Solution Overview
Problem
The challenge is to increase the number of electronic components within a finite server space to enhance performance without compromising the server's functionality and efficiency.
Innovation Solution
The server is designed with a casing that includes three accommodation spaces: one for a disk drive assembly, one for a fan assembly, and one for a host assembly, expansion card assemblies, and a power supply assembly, allowing for optimal arrangement and placement of components like hard disk drives, fans, circuit boards, and power supplies, along with features like adjustable trays and integrated fan connectors for improved maintenance and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of electronic components inside the server is increased, then the performance of the server is improved, but the internal space of the server is limited
Solution Approach 1:
The server interior is divided into three distinct accommodation spaces (first, second, and third) within the casing, each dedicated to specific component types. This segmentation allows for systematic organization of multiple components without spatial conflict, enabling increased component quantity while maintaining order and accessibility within the limited internal volume.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by placing components at different vertical and horizontal levels. The first disk drive assembly is in the first accommodation space, the fan assembly in the second, and the host assembly with expansion cards in the third. This multi-level arrangement maximizes the use of available internal space, allowing more components to be accommodated without increasing the server's external dimensions.
2Quantity of substance
If more components are arranged in the third accommodation space, then component accommodation is maximized, but heat dissipation becomes more challenging
Solution Approach 1:
The fan assembly, which is responsible for heat dissipation, is extracted and placed in a separate second accommodation space, positioned between the first and third accommodation spaces. This separation ensures that the cooling function is independent from the component-dense third accommodation space, allowing effective heat removal without interfering with component arrangement or increasing the overall server volume.
3Quantity of substance
If components are densely arranged to maximize space utilization, then performance is improved, but maintenance and accessibility become difficult
Solution Approach 1:
By dividing the server interior into three separate accommodation spaces, each component type is localized to its designated area. The first disk drive assembly is isolated in the first space, the fan assembly in the second, and the host assembly with expansion cards in the third. This segmentation allows maintenance personnel to access and service specific components without needing to navigate through densely packed mixed components, thereby maintaining ease of repair while achieving high component density.
Data Source
AI summary
A server includes a casing, a first disk drive assembly, a fan assembly, a host assembly, a first expansion card assembly, a second expansion card assembly, a power supply assembly, and a second disk drive assembly. The casing has a first to third space. The second space is located between the first and third space. The first disk drive assembly, the fan assembly, and the host assembly are respectively located in the first to third space. The first and second expansion card assembly are located in the third space and above the host assembly. The power supply assembly is located in the third space. The second expansion card assembly is located between the first expansion card assembly and the power supply assembly. The second disk drive assembly is located in the third space and located between the power supply assembly and the second expansion card assembly.