Server Tray Liquid Cold Plate for Hard-to-Cool Processor Zones
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inadequate cooling systems for electronic equipment in data centers often lead to overheating, resulting in device failure due to insufficient heat dissipation, especially in areas where forced convection is ineffective, causing significant costs and efficiency losses.
Innovation Solution
A liquid cold plate assembly integrated with a server tray package that includes a base portion and a top portion forming a cooling liquid flow path, with thermal interface materials and heat transfer surfaces to efficiently dissipate heat from heat-generating devices using a circulating cooling liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced convection cooling is used, then cooling coverage can be achieved in accessible areas, but cooling effectiveness is insufficient in difficult-to-cool areas
Solution Approach 1:
The cooling system is divided into two distinct segments: forced convection fans for general cooling and liquid cold plates for targeted cooling of difficult-to-cool areas. This segmentation allows each cooling method to be optimized for its specific function, with the cold plate assembly directly contacting heat-generating components in areas where air cooling is ineffective.
Solution Approach 2:
A thermal interface material is introduced as an intermediary between the heat-generating electronic device and the cold plate. This intermediary ensures efficient thermal contact while accommodating surface irregularities, enabling effective heat transfer from the device to the cooling liquid without direct mechanical contact that could damage either component.
2Temperature
If liquid cold plate assembly is integrated with server tray package, then direct liquid cooling is achieved for high heat-generating devices, but device complexity increases
Solution Approach 1:
The cold plate assembly is merged with the server tray package to form an integrated cooling system. The base portion of the cold plate is mounted directly to the motherboard assembly, and the top portion is positioned to contact heat-generating devices, creating a unified structure that combines mechanical support and thermal management functions.
Solution Approach 2:
The base portion of the cold plate serves multiple functions: it provides structural support for the top portion, acts as a mounting surface for electronic devices, and serves as a thermal pathway for heat transfer. This multi-functionality reduces the need for separate components and simplifies the overall system architecture.
3Strength
If base portion and top portion form enclosed volume, then mechanical rigidity and sealing are improved, but manufacturing complexity increases
Solution Approach 1:
The cold plate is divided into a base portion and a top portion that can be manufactured separately and then assembled. This segmentation allows each part to be optimized for its specific manufacturing process and quality requirements, while the assembly creates the enclosed volume needed for mechanical rigidity and sealing.
Solution Approach 2:
Thermal interface materials and sealing structures are pre-positioned on the base portion before the top portion is attached. This preliminary action ensures proper sealing and thermal contact without requiring complex alignment procedures during final assembly, reducing manufacturing complexity while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides effective direct liquid cooling for high heat-generating electronic devices, offering mechanical rigidity, customizable cooling paths, and sealing, thereby preventing overheating and ensuring reliable operation of data center equipment.
Implementation Method 1
a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member
Implementation Method 2
circulating a flow of a cooling liquid to a server tray package... circulating the flow of the cooling liquid into an inlet port of the heat transfer member; circulating the flow of the cooling liquid from the inlet port through a cooling liquid flow path defined through the heat transfer member to transfer heat from the at least one heat generating processor device
Data Source
AI summary
A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.